JPS59109155U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS59109155U JPS59109155U JP284483U JP284483U JPS59109155U JP S59109155 U JPS59109155 U JP S59109155U JP 284483 U JP284483 U JP 284483U JP 284483 U JP284483 U JP 284483U JP S59109155 U JPS59109155 U JP S59109155U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- component body
- electronic components
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本案の一実施例を示す横断面図、第２
・図はリードの断面図、第３図は樹脂モールド方法を説
明するための側断面図、第４図は本案の他の実施例を示
すリードの断面図である。
図中、２は部品本体（半導体素子）、３１〜３゜はリー
ド、４，４１は凹部、６，６′は樹脂材である。Figure 1 is a cross-sectional view showing one embodiment of the present invention;
・The figure is a sectional view of the lead, FIG. 3 is a side sectional view for explaining the resin molding method, and FIG. 4 is a sectional view of the lead showing another embodiment of the present invention. In the figure, 2 is a component body (semiconductor element), 31 to 3 degrees are leads, 4 and 41 are recesses, and 6 and 6' are resin materials.
Claims (1)
出すると共に、部品本体とリードとを電気的に接続し、
かつ部品本体を含む主要部分を樹脂材にてモールド被覆
したものにおいて、上記リードのうち、両側に位置する
リードの樹脂材より露呈する部分に、それの導出方向に
凹部を形成すると共に、この凹部に樹脂材を充実させた
ことを特徴とする電子部品。Leading out a plurality of leads from the component body or the vicinity of the component body, and electrically connecting the component body and the leads,
In the case where the main part including the main part of the component is molded and covered with a resin material, a recess is formed in the lead-out direction in the part of the lead that is exposed from the resin material of the leads located on both sides, and the recess is formed in the lead-out direction. Electronic parts characterized by the addition of resin materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP284483U JPS59109155U (en) | 1983-01-12 | 1983-01-12 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP284483U JPS59109155U (en) | 1983-01-12 | 1983-01-12 | electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59109155U true JPS59109155U (en) | 1984-07-23 |
Family
ID=30134492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP284483U Pending JPS59109155U (en) | 1983-01-12 | 1983-01-12 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59109155U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015010913A (en) * | 2013-06-28 | 2015-01-19 | 日本精機株式会社 | Liquid level detector |
| WO2020049672A1 (en) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | Semiconductor device |
-
1983
- 1983-01-12 JP JP284483U patent/JPS59109155U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015010913A (en) * | 2013-06-28 | 2015-01-19 | 日本精機株式会社 | Liquid level detector |
| WO2020049672A1 (en) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | Semiconductor device |
| JPWO2020049672A1 (en) * | 2018-09-06 | 2021-08-12 | 三菱電機株式会社 | Semiconductor device |
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