JPS59135633U - Resin mold chip parts - Google Patents

Resin mold chip parts

Info

Publication number
JPS59135633U
JPS59135633U JP2995283U JP2995283U JPS59135633U JP S59135633 U JPS59135633 U JP S59135633U JP 2995283 U JP2995283 U JP 2995283U JP 2995283 U JP2995283 U JP 2995283U JP S59135633 U JPS59135633 U JP S59135633U
Authority
JP
Japan
Prior art keywords
resin mold
hole
chip parts
mold chip
element body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2995283U
Other languages
Japanese (ja)
Inventor
長谷川　信男
水野　泰一
徹也 作田
芳樹 橋本
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP2995283U priority Critical patent/JPS59135633U/en
Publication of JPS59135633U publication Critical patent/JPS59135633U/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来例の斜視図、第３図はこの考
案の一実施例の部分斜視図、第４図はその部分断面図で
ある。 Ａ・・・素体、５・・・リード、６・・・モールド樹脂
、７・・・貫通孔。1 and 2 are perspective views of a conventional example, FIG. 3 is a partial perspective view of an embodiment of this invention, and FIG. 4 is a partial sectional view thereof. A...Element body, 5...Lead, 6...Mold resin, 7...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品素体と、この素体に接続されて中間部に貫通孔
を形成した電極取出し用板状リードと、前記素体および
前記リードの前記貫通孔を含む一部を埋設被覆するとと
もに前記貫通孔内に充填されたモールド樹脂とを備えた
樹脂モールドチップ部品。An electronic component element body, a plate-shaped lead for taking out an electrode connected to the element body and having a through hole formed in an intermediate portion, and a part of the element body and the lead including the through hole is buried and covered, and the through hole is A resin molded chip component with a molded resin filled in the hole.
JP2995283U 1983-03-01 1983-03-01 Resin mold chip parts Pending JPS59135633U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2995283U JPS59135633U (en) 1983-03-01 1983-03-01 Resin mold chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2995283U JPS59135633U (en) 1983-03-01 1983-03-01 Resin mold chip parts

Publications (1)

Publication Number Publication Date
JPS59135633U true JPS59135633U (en) 1984-09-10

Family

ID=30160823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2995283U Pending JPS59135633U (en) 1983-03-01 1983-03-01 Resin mold chip parts

Country Status (1)

Country Link
JP (1) JPS59135633U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS487413U (en) * 1971-06-09 1973-01-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS487413U (en) * 1971-06-09 1973-01-27

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