JPS59127246U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS59127246U JPS59127246U JP2139383U JP2139383U JPS59127246U JP S59127246 U JPS59127246 U JP S59127246U JP 2139383 U JP2139383 U JP 2139383U JP 2139383 U JP2139383 U JP 2139383U JP S59127246 U JPS59127246 U JP S59127246U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated semiconductor
- back surface
- fixed substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の樹脂封止型半導体装置の部分
省略平面図及びＡ−Ａ線に沿う断面図、 １、第３
図及び第４図は本考案の一実施例を示す側断面図及びＢ
−Ｂ線に沿う断面図、第５図は第３図の一部拡大図であ
る。
３・・・半導体素子、５・・・外装樹脂材、８・・・樹
脂膜、１０・・・素子固着基板、ｍ・・・裏面（粗面）
。1 and 2 are a partially omitted plan view and a sectional view taken along line A-A of a conventional resin-sealed semiconductor device;
FIG. 4 is a side sectional view showing an embodiment of the present invention, and FIG.
A sectional view taken along line -B, and FIG. 5 is a partially enlarged view of FIG. 3. 3... Semiconductor element, 5... Exterior resin material, 8... Resin film, 10... Element fixing substrate, m... Back surface (rough surface)
.
Claims (1)
する樹月、＠膜を薄膜状にして外装樹脂材を完全モール
ド成形した半導体装置において、前記素子固着基板の裏
面を粗面化したことを特徴とする樹脂封止型半導体装置
。In a semiconductor device in which the exterior resin material is completely molded with a thin film of the tree covered on the back surface of the non-element-fixed side of the element-fixed substrate that also serves as a heat sink, the back surface of the element-fixed substrate is roughened. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2139383U JPS59127246U (en) | 1983-02-15 | 1983-02-15 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2139383U JPS59127246U (en) | 1983-02-15 | 1983-02-15 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59127246U true JPS59127246U (en) | 1984-08-27 |
Family
ID=30152517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2139383U Pending JPS59127246U (en) | 1983-02-15 | 1983-02-15 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127246U (en) |
-
1983
- 1983-02-15 JP JP2139383U patent/JPS59127246U/en active Pending
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