JPS6025145U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6025145U JPS6025145U JP11531783U JP11531783U JPS6025145U JP S6025145 U JPS6025145 U JP S6025145U JP 11531783 U JP11531783 U JP 11531783U JP 11531783 U JP11531783 U JP 11531783U JP S6025145 U JPS6025145 U JP S6025145U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor element
- lowered
- semiconductor
- honding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の装置の断面図、第２図、第３図は本考案
の実施例の断面図である。
１・・・・・・半導体素子、２・・・・・・外部引き出
し用リード（封止部内はステッチ）、３・・・・・・ア
イランド（半導体素子搭載部）、３′・・・凹部、４・
・・・・・封止樹脂。FIG. 1 is a sectional view of a conventional device, and FIGS. 2 and 3 are sectional views of an embodiment of the present invention. 1... Semiconductor element, 2... Lead for external extraction (stitched inside the sealing part), 3... Island (semiconductor element mounting part), 3'... Recessed part , 4・
...Sealing resin.
Claims (1)
素子搭載部の周辺が折り曲けられて低くなっており、こ
の５低くなった面の上をホンディング線がまたいている
ことを特徴とする半導体装置。A semiconductor device characterized in that in an island part on which a semiconductor element is mounted, the periphery of the semiconductor element mounting part is bent and lowered, and a honding line straddles the lowered surface. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11531783U JPS6025145U (en) | 1983-07-25 | 1983-07-25 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11531783U JPS6025145U (en) | 1983-07-25 | 1983-07-25 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6025145U true JPS6025145U (en) | 1985-02-20 |
Family
ID=30266236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11531783U Pending JPS6025145U (en) | 1983-07-25 | 1983-07-25 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025145U (en) |
-
1983
- 1983-07-25 JP JP11531783U patent/JPS6025145U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (en) | semiconductor equipment | |
| JPS6025145U (en) | semiconductor equipment | |
| JPS5837156U (en) | semiconductor equipment | |
| JPS6099547U (en) | semiconductor equipment | |
| JPS6033452U (en) | Resin-encapsulated semiconductor device | |
| JPS5914348U (en) | Resin-encapsulated semiconductor device | |
| JPS59111052U (en) | Hybrid integrated circuit device | |
| JPS5858353U (en) | Lead frame for semiconductor devices | |
| JPS6027444U (en) | Resin-encapsulated semiconductor device | |
| JPS59117162U (en) | Resin-encapsulated semiconductor device | |
| JPS5887355U (en) | semiconductor equipment | |
| JPS58120661U (en) | semiconductor equipment | |
| JPS5832655U (en) | semiconductor equipment | |
| JPS5837147U (en) | semiconductor equipment | |
| JPS5844842U (en) | semiconductor equipment | |
| JPS59138241U (en) | semiconductor equipment | |
| JPS5834742U (en) | Heat dissipation structure for resin-encapsulated semiconductor devices | |
| JPS5840843U (en) | Resin-encapsulated semiconductor device | |
| JPS6094835U (en) | semiconductor equipment | |
| JPS6030544U (en) | semiconductor equipment | |
| JPS58120666U (en) | Semiconductor integrated circuit device | |
| JPS6076040U (en) | semiconductor equipment | |
| JPS59104546U (en) | Lead frame for semiconductor devices | |
| JPS5999297U (en) | magnetic bubble memory chip | |
| JPS5872844U (en) | LSI package |