JPS59138241U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59138241U JPS59138241U JP3169283U JP3169283U JPS59138241U JP S59138241 U JPS59138241 U JP S59138241U JP 3169283 U JP3169283 U JP 3169283U JP 3169283 U JP3169283 U JP 3169283U JP S59138241 U JPS59138241 U JP S59138241U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- heat sink
- semiconductor element
- back surface
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を説明する断面図、第２図は本考案を説
明する断面図である。
１１は半導体素子、１２は放熱板、１３は封止樹脂、１
４は取付孔である。FIG. 1 is a sectional view illustrating a conventional example, and FIG. 2 is a sectional view illustrating the present invention. 11 is a semiconductor element, 12 is a heat sink, 13 is a sealing resin, 1
4 is a mounting hole.
Claims (1)
半導体素子と該半導体素子および前記放熱板の裏面を被
覆する封止樹脂とを具備して成る半導体装置。A semiconductor device comprising a heat sink having a roughened back surface, a semiconductor element fixed to the main surface of the heat sink, and a sealing resin covering the semiconductor element and the back surface of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169283U JPS59138241U (en) | 1983-03-04 | 1983-03-04 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169283U JPS59138241U (en) | 1983-03-04 | 1983-03-04 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59138241U true JPS59138241U (en) | 1984-09-14 |
Family
ID=30162535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3169283U Pending JPS59138241U (en) | 1983-03-04 | 1983-03-04 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138241U (en) |
-
1983
- 1983-03-04 JP JP3169283U patent/JPS59138241U/en active Pending
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