JPS5869955U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5869955U
JPS5869955U JP16507181U JP16507181U JPS5869955U JP S5869955 U JPS5869955 U JP S5869955U JP 16507181 U JP16507181 U JP 16507181U JP 16507181 U JP16507181 U JP 16507181U JP S5869955 U JPS5869955 U JP S5869955U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
recorded
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16507181U
Other languages
Japanese (ja)
Inventor
金崎　武徳
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP16507181U priority Critical patent/JPS5869955U/en
Publication of JPS5869955U publication Critical patent/JPS5869955U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導装置の斜視図、第２図は本考案の第
１の実施例の斜視図、第３図ａは本考案の第２の実施例
の斜視図、第３図すは第３図ａのＡ−Ａ’線に沿って切
断しその切断面を示す断面図である。尚図において、 １′、　１“、　１“’、５，７．８・・・・・・リー
ド、２゜６・・・・・・放熱部、３・・・・・・半導体
素子固着部、４・・・・・・プラスチックモールド樹脂
のケースが設けられる部分。FIG. 1 is a perspective view of a conventional semiconductor device, FIG. 2 is a perspective view of a first embodiment of the present invention, FIG. 3a is a perspective view of a second embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along the line AA' in FIG. 3a and showing the cut surface thereof. In the figure, 1', 1", 1"', 5, 7.8...Lead, 2゜6...Heat radiation part, 3...Semiconductor element fixing part , 4... A part where a plastic mold resin case is provided.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] モールド樹脂内に折り返し部分を有するリードを用いた
ことを特徴とする半導体装置。A semiconductor device characterized by using a lead having a folded portion within a molded resin.
JP16507181U 1981-11-05 1981-11-05 semiconductor equipment Pending JPS5869955U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16507181U JPS5869955U (en) 1981-11-05 1981-11-05 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16507181U JPS5869955U (en) 1981-11-05 1981-11-05 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5869955U true JPS5869955U (en) 1983-05-12

Family

ID=29957281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16507181U Pending JPS5869955U (en) 1981-11-05 1981-11-05 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5869955U (en)

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