JPH0434744U - - Google Patents

Info

Publication number
JPH0434744U
JPH0434744U JP1990075938U JP7593890U JPH0434744U JP H0434744 U JPH0434744 U JP H0434744U JP 1990075938 U JP1990075938 U JP 1990075938U JP 7593890 U JP7593890 U JP 7593890U JP H0434744 U JPH0434744 U JP H0434744U
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
heat dissipation
view
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990075938U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990075938U priority Critical patent/JPH0434744U/ja
Publication of JPH0434744U publication Critical patent/JPH0434744U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示すもので、ａは
リードフレームの要部平面図、ｂは同上の半導体
装置が実装された要部平面図、ｃは同上の側面図
、第２図は従来の半導体装置の一例を示すもので
、ａはリードフレームの平面図、ｂは 同上の側
面図、ｃは同上の要部平面図、ｄは同上の半導体
装置が実装された要部平面図、ｅは同上の樹脂が
モールドされた平面図、ｆは同上の側面図を示す
ものである。 １，２……半導体装置、４……リードフレーム
、４ａ……リードフレーム、６……放熱板。 FIG. 1 shows an embodiment of the present invention, in which a is a plan view of the main part of a lead frame, b is a plan view of the main part on which the above semiconductor device is mounted, c is a side view of the above, and FIG. 1 shows an example of a conventional semiconductor device, where a is a plan view of a lead frame, b is a side view of the same as above, c is a plan view of the main part of the same as above, and d is a plan view of the main part of the same semiconductor device mounted on it. , e shows a plan view of the molded resin, and f shows a side view of the same. 1, 2... Semiconductor device, 4... Lead frame, 4a... Lead frame, 6... Heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱量の大きい半導体装置のリードフレームへ
の実装構造において、リードフレームの少なくと
も半導体装置の実装部の裏面側に、放熱性に優れ
かつ絶縁性を有する放熱板を接着すると共に、前
記リードフレームの表面に半導体装置を実装した
ことを特徴とする半導体装置の実装構造。 In a structure in which a semiconductor device that generates a large amount of heat is mounted on a lead frame, a heat dissipation plate having excellent heat dissipation and insulation properties is bonded to at least the back side of the mounting part of the semiconductor device of the lead frame, and the surface of the lead frame is A mounting structure for a semiconductor device, characterized in that a semiconductor device is mounted on a semiconductor device.
JP1990075938U 1990-07-17 1990-07-17 Pending JPH0434744U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990075938U JPH0434744U (en) 1990-07-17 1990-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990075938U JPH0434744U (en) 1990-07-17 1990-07-17

Publications (1)

Publication Number Publication Date
JPH0434744U true JPH0434744U (en) 1992-03-23

Family

ID=31616957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990075938U Pending JPH0434744U (en) 1990-07-17 1990-07-17

Country Status (1)

Country Link
JP (1) JPH0434744U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096432A (en) * 2012-11-08 2014-05-22 Mitsubishi Materials Corp Substrate for power module with copper plate and method for manufacturing substrate for power module with copper plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096432A (en) * 2012-11-08 2014-05-22 Mitsubishi Materials Corp Substrate for power module with copper plate and method for manufacturing substrate for power module with copper plate

Similar Documents

Publication Publication Date Title
JPH0434744U (en)
JPH0451192U (en)
JPS62118453U (en)
JPH0332432U (en)
JPS5834742U (en) Heat dissipation structure for resin-encapsulated semiconductor devices
JPS63100845U (en)
JPS62204338U (en)
JPS63195727U (en)
JPS61121756U (en)
JPH0211351U (en)
JPH0459949U (en)
JPS58133939U (en) Heat sink for semiconductor parts
JPH03128946U (en)
JPS62204337U (en)
JPS6318851U (en)
JPH0316346U (en)
JPH0415852U (en)
JPS6113939U (en) Resin-insulated semiconductor device
JPH0256450U (en)
JPH0190028U (en)
JPH03106756U (en)
JPS63182539U (en)
JPH02129793U (en)
JPS59127246U (en) Resin-encapsulated semiconductor device
JPS6413140U (en)