JPS63100845U - - Google Patents
Info
- Publication number
- JPS63100845U JPS63100845U JP19637486U JP19637486U JPS63100845U JP S63100845 U JPS63100845 U JP S63100845U JP 19637486 U JP19637486 U JP 19637486U JP 19637486 U JP19637486 U JP 19637486U JP S63100845 U JPS63100845 U JP S63100845U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- interposed
- conductive agent
- heat
- iron plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000006258 conductive agent Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Description
第１図は本考案の半導体素子の取付構造を示す
図、第２図は従来の半導体素子の取付構造を示す
図である。
１……半導体素子、２……放熱板、３……シリ
コングリス、４……ビス、５……ナツト、６……
鉄板。
FIG. 1 is a diagram showing a mounting structure for a semiconductor device according to the present invention, and FIG. 2 is a diagram showing a conventional mounting structure for a semiconductor device. 1... Semiconductor element, 2... Heat sink, 3... Silicon grease, 4... Screw, 5... Nut, 6...
Iron plate.
Claims (1)
との間に導熱剤を介在させて互いに密着させ、こ
の放熱板の他方の面とタツプ穴を設けた鉄板との
間に導熱剤を介在させ、半導体素子、放熱板、鉄
板を共締めしたことを特徴とする半導体素子の取
付構造。 A heat conductive agent is interposed between the semiconductor element and one surface of a heat dissipation plate provided with through holes to bring them into close contact with each other, and a heat conductive agent is interposed between the other surface of this heat dissipation plate and an iron plate provided with tapped holes. A mounting structure for a semiconductor device, characterized in that the semiconductor device, a heat sink, and an iron plate are fastened together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19637486U JPS63100845U (en) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19637486U JPS63100845U (en) | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100845U true JPS63100845U (en) | 1988-06-30 |
Family
ID=31155133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19637486U Pending JPS63100845U (en) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100845U (en) |
-
1986
- 1986-12-19 JP JP19637486U patent/JPS63100845U/ja active Pending
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