JPS62204338U - - Google Patents
Info
- Publication number
- JPS62204338U JPS62204338U JP9265486U JP9265486U JPS62204338U JP S62204338 U JPS62204338 U JP S62204338U JP 9265486 U JP9265486 U JP 9265486U JP 9265486 U JP9265486 U JP 9265486U JP S62204338 U JPS62204338 U JP S62204338U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- envelope
- view
- showing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の樹脂モールドパツ
ケージの外囲器を示す斜視図、第２図は第１図の
樹脂モールドパツケージを放熱体にネジ締めして
取付けた様子を示す側面図、第３図は第２図にお
ける放熱板のスリツト縞の歪みの様子を示す拡大
図である。第４図ａは本考案の他の実施例の缶ケ
ースの外囲器を示す斜視図、第４図ｂは第４図ａ
の缶ケースを放熱体にネジ締めして取付けた様子
を示す側面図である。
１……樹脂モールド部、２……放熱板部、３…
…スリツト縞、４……ネジ、５……放熱体、６…
…ナツト、７……缶ケース。
FIG. 1 is a perspective view showing an envelope of a resin molded package according to an embodiment of the present invention, and FIG. 2 is a side view showing how the resin molded package shown in FIG. 1 is screwed and attached to a heat sink. FIG. 3 is an enlarged view showing how the slit stripes of the heat sink in FIG. 2 are distorted. FIG. 4a is a perspective view showing an envelope of a can case according to another embodiment of the present invention, and FIG. 4b is a perspective view of a can case according to another embodiment of the present invention.
FIG. 3 is a side view showing how the can case is screwed and attached to the heat sink. 1... Resin mold part, 2... Heat sink part, 3...
...Slit stripes, 4...screws, 5...heat sinks, 6...
...Natsuto, 7...Can case.
Claims (1)
部もしくは放熱板の側面部に極めて細からスリツ
ト縞を有することを特徴とする半導体外囲器。 1. A semiconductor envelope of a power semiconductor element having a heat sink, characterized in that a part of the envelope or a side surface of the heat sink has extremely fine slit stripes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265486U JPH0442928Y2 (en) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265486U JPH0442928Y2 (en) | 1986-06-17 | 1986-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62204338U true JPS62204338U (en) | 1987-12-26 |
| JPH0442928Y2 JPH0442928Y2 (en) | 1992-10-12 |
Family
ID=30954550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9265486U Expired JPH0442928Y2 (en) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442928Y2 (en) |
-
1986
- 1986-06-17 JP JP9265486U patent/JPH0442928Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442928Y2 (en) | 1992-10-12 |