JPS61188363U - - Google Patents
Info
- Publication number
- JPS61188363U JPS61188363U JP1985071960U JP7196085U JPS61188363U JP S61188363 U JPS61188363 U JP S61188363U JP 1985071960 U JP1985071960 U JP 1985071960U JP 7196085 U JP7196085 U JP 7196085U JP S61188363 U JPS61188363 U JP S61188363U
- Authority
- JP
- Japan
- Prior art keywords
- bent
- semiconductor element
- heat sink
- resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例による半導体装置を
示す断面図、第２図は本考案の一実施例に用いる
放熱板の側面図、第３図はその放熱板の斜視図で
ある。第４図は従来技術の半導体装置の一例を示
す断面図、第５図はその放熱板の側面図、第６図
はその斜視図である。
１，９……半導体素子、２ａ……素子取付部、
２……コの字形取付板、３，３ａ……放熱板、４
……ネジ、５，６……絶縁体、７……樹脂、８…
…インサート電極。
FIG. 1 is a sectional view showing a semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view of a heat sink used in an embodiment of the present invention, and FIG. 3 is a perspective view of the heat sink. FIG. 4 is a sectional view showing an example of a conventional semiconductor device, FIG. 5 is a side view of its heat sink, and FIG. 6 is a perspective view thereof. 1, 9... Semiconductor element, 2a... Element mounting part,
2... U-shaped mounting plate, 3, 3a... Heat sink, 4
...Screw, 5, 6...Insulator, 7...Resin, 8...
...insert electrode.
Claims (1)
げ部に半導体素子を取りつけ、該半導体素子取り
つけ部を樹脂で被覆したことを特徴とする半導体
装置。 A semiconductor device characterized in that a part of a heat sink is bent at a right angle, a semiconductor element is attached to the bent part, and the semiconductor element mounting part is covered with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985071960U JPS61188363U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985071960U JPS61188363U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188363U true JPS61188363U (en) | 1986-11-25 |
Family
ID=30609925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985071960U Pending JPS61188363U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188363U (en) |
-
1985
- 1985-05-15 JP JP1985071960U patent/JPS61188363U/ja active Pending