JPS61207037U - - Google Patents
Info
- Publication number
- JPS61207037U JPS61207037U JP9325285U JP9325285U JPS61207037U JP S61207037 U JPS61207037 U JP S61207037U JP 9325285 U JP9325285 U JP 9325285U JP 9325285 U JP9325285 U JP 9325285U JP S61207037 U JPS61207037 U JP S61207037U
- Authority
- JP
- Japan
- Prior art keywords
- fin portion
- heat dissipating
- dissipating fin
- primary
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す平面図
及び断面図、第２図ａ，ｂは１次モールド後の様
子を示す平面図及び断面図、第３図ａ，ｂはチツ
プをダイボンドしたリードフレームの様子を示す
平面図及び断面図、第４図ａ，ｂは従来例を示す
平面図及び断面図である。
１１…リードフレーム、１２…放熱フイン部、
１３…チツプ、１５…１次モールド樹脂、１６…
２次モールド樹脂。
Figures 1a and b are a plan view and a sectional view showing an embodiment of the present invention, Figures 2a and b are a plan view and a sectional view showing the state after primary molding, and Figures 3a and b are chips. FIGS. 4a and 4b are a plan view and a sectional view showing a conventional example. 11...Lead frame, 12...Radiation fin part,
13... Chip, 15... Primary mold resin, 16...
Secondary mold resin.
Claims (1)
ン部にチツプをダイボンドして１次モールドし、
該１次モールド樹脂よりはみ出た前記放熱フイン
部をカツトして残された放熱フイン部を含む全体
を２次モールドしてなることを特徴とするＤＩＰ
型パワーデバイス。 The chip is die-bonded to the heat dissipation fin portion integrally formed on the lead frame and then primary molded.
A DIP characterized in that the heat dissipating fin portion protruding from the primary molding resin is cut and the entire body including the remaining heat dissipating fin portion is secondary molded.
type power device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9325285U JPS61207037U (en) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9325285U JPS61207037U (en) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207037U true JPS61207037U (en) | 1986-12-27 |
Family
ID=30650764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9325285U Pending JPS61207037U (en) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207037U (en) |
-
1985
- 1985-06-18 JP JP9325285U patent/JPS61207037U/ja active Pending