JPS6274342U - - Google Patents
Info
- Publication number
- JPS6274342U JPS6274342U JP16679585U JP16679585U JPS6274342U JP S6274342 U JPS6274342 U JP S6274342U JP 16679585 U JP16679585 U JP 16679585U JP 16679585 U JP16679585 U JP 16679585U JP S6274342 U JPS6274342 U JP S6274342U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- semiconductor device
- resin
- substrate
- fluorescent pigment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂封止型半導体装置の
一実施例を示す斜視図、第２図は第１図のＡ―Ａ
線に沿う側断面図、第３図は本考案の他の実施例
を示す側断面図である。第４図は従来の樹脂封止
型半導体装置の一例を示す平面図、第５図は第４
図のＢ―Ｂ線に沿う側断面図、第６図は半導体装
置製造における樹脂モールドを説明するための断
面図である。
１……基板（放熱板）、４……半導体ペレツト
、１０，１０′……外装樹脂材、ａ……蛍光顔料
。
FIG. 1 is a perspective view showing an embodiment of a resin-sealed semiconductor device according to the present invention, and FIG. 2 is an A-A in FIG.
FIG. 3 is a side sectional view showing another embodiment of the present invention. FIG. 4 is a plan view showing an example of a conventional resin-sealed semiconductor device, and FIG.
FIG. 6 is a side cross-sectional view taken along the line BB in the figure, and a cross-sectional view for explaining a resin mold in manufacturing a semiconductor device. 1... Substrate (heat sink), 4... Semiconductor pellet, 10, 10'... Exterior resin material, a... Fluorescent pigment.
Claims (1)
、上記半導体ペレツトを含む主要部分を、蛍光顔
料を含有した外装樹脂材どでモールドしたことを
特徴とする樹脂封止型半導体装置。 1. A resin-sealed semiconductor device, characterized in that a semiconductor pellet is fixed to an element mounting portion on a substrate, and the main portion including the semiconductor pellet is molded with an exterior resin material containing a fluorescent pigment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16679585U JPS6274342U (en) | 1985-10-30 | 1985-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16679585U JPS6274342U (en) | 1985-10-30 | 1985-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6274342U true JPS6274342U (en) | 1987-05-13 |
Family
ID=31098110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16679585U Pending JPS6274342U (en) | 1985-10-30 | 1985-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226710A (en) * | 2001-01-30 | 2002-08-14 | Nitto Denko Corp | Resin composition for sealing semiconductor and semiconductor device |
-
1985
- 1985-10-30 JP JP16679585U patent/JPS6274342U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226710A (en) * | 2001-01-30 | 2002-08-14 | Nitto Denko Corp | Resin composition for sealing semiconductor and semiconductor device |
| JP4689055B2 (en) * | 2001-01-30 | 2011-05-25 | 日東電工株式会社 | Semiconductor device for preventing tampering of pachinko machines |