JPS61186236U - - Google Patents
Info
- Publication number
- JPS61186236U JPS61186236U JP7134985U JP7134985U JPS61186236U JP S61186236 U JPS61186236 U JP S61186236U JP 7134985 U JP7134985 U JP 7134985U JP 7134985 U JP7134985 U JP 7134985U JP S61186236 U JPS61186236 U JP S61186236U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- utility
- sectional shape
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ＡおよびＢは夫々本考案の一実施例を示
す平面図およびＡ―Ａ′断面図、第２図は従来例
の断面図、第３図は第２図のものを用いて樹脂封
止した製造の部分断面図、第４図は第１図のもの
を用いて樹脂封止した製造の部分断面図である。
１……リードフレーム、２……溝、３，４……
溝の断面、５……封止樹脂、６……ソルダー、７
……半導体チツプ、８……すき間。
1A and 1B are a plan view and a cross-sectional view taken along line A-A' showing an embodiment of the present invention, FIG. FIG. 4 is a partial cross-sectional view of a resin-sealed product using the one shown in FIG. 1. 1... Lead frame, 2... Groove, 3, 4...
Cross section of groove, 5...Sealing resin, 6...Solder, 7
...Semiconductor chip, 8...Gap.
Claims (1)
の溝をほどこした半導体装置において、前記溝の
断面形状が台形状であることを特徴とする半導体
装置。 1. A semiconductor device having at least one groove formed around a mounting area of a semiconductor element, wherein the groove has a trapezoidal cross-sectional shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134985U JPS61186236U (en) | 1985-05-14 | 1985-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134985U JPS61186236U (en) | 1985-05-14 | 1985-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61186236U true JPS61186236U (en) | 1986-11-20 |
Family
ID=30608764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7134985U Pending JPS61186236U (en) | 1985-05-14 | 1985-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61186236U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100526837B1 (en) * | 2000-04-27 | 2005-11-08 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| JP2016213505A (en) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | Package mold for light-emitting device, and light-emitting device using the same |
-
1985
- 1985-05-14 JP JP7134985U patent/JPS61186236U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100526837B1 (en) * | 2000-04-27 | 2005-11-08 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| JP2016213505A (en) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | Package mold for light-emitting device, and light-emitting device using the same |