JPS6296858U - - Google Patents
Info
- Publication number
- JPS6296858U JPS6296858U JP19010085U JP19010085U JPS6296858U JP S6296858 U JPS6296858 U JP S6296858U JP 19010085 U JP19010085 U JP 19010085U JP 19010085 U JP19010085 U JP 19010085U JP S6296858 U JPS6296858 U JP S6296858U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- frame
- integrated circuit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の実施例のリードフレームを
示す平面図、第２図は第１図のリードフレームに
樹脂封止した状態を示す平面図、第３図は他の実
施例を示す平面図、第４図は従来のリードフレー
ムを示す平面図、第５図は第４図のリードフレー
ムに樹脂封止した状態を示す平面図、第６図は第
５図のＡ部拡大図である。
図中、１はフレーム枠部、２はアイランド、３
はタイバー、４はアウターリード、５は枠部、６
はスリツト部、７，８は樹脂、９，１０は切断部
、Ｕは単位リードフレームである。なお、各図に
おいて同符号は同一または相当部分を示す。
Fig. 1 is a plan view showing a lead frame according to an embodiment of this invention, Fig. 2 is a plan view showing the lead frame shown in Fig. 1 sealed with resin, and Fig. 3 is a plan view showing another embodiment. , FIG. 4 is a plan view showing a conventional lead frame, FIG. 5 is a plan view showing the lead frame shown in FIG. 4 sealed with resin, and FIG. 6 is an enlarged view of section A in FIG. In the figure, 1 is the frame, 2 is the island, and 3
is the tie bar, 4 is the outer lead, 5 is the frame, 6
1 is a slit portion, 7 and 8 are resins, 9 and 10 are cutting portions, and U is a unit lead frame. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
単位リードフレームの間に設けられた枠部に、切
断面が互に接する切断部を設けたことを特徴とす
る樹脂封止半導体装置用リードフレーム。 1. A lead frame for a resin-sealed semiconductor device forming one semiconductor integrated circuit, characterized in that a frame portion provided between adjacent unit lead frames is provided with cut portions whose cut surfaces touch each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19010085U JPS6296858U (en) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19010085U JPS6296858U (en) | 1985-12-09 | 1985-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296858U true JPS6296858U (en) | 1987-06-20 |
Family
ID=31143004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19010085U Pending JPS6296858U (en) | 1985-12-09 | 1985-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296858U (en) |
-
1985
- 1985-12-09 JP JP19010085U patent/JPS6296858U/ja active Pending
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