JPH0260257U - - Google Patents
Info
- Publication number
- JPH0260257U JPH0260257U JP14016288U JP14016288U JPH0260257U JP H0260257 U JPH0260257 U JP H0260257U JP 14016288 U JP14016288 U JP 14016288U JP 14016288 U JP14016288 U JP 14016288U JP H0260257 U JPH0260257 U JP H0260257U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- width
- external leads
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体集積
回路用パツケージの斜視図、第２図はこの考案の
一実施例によるパツケージを構成するためのリー
ドフレームを示す斜視図、第３図は従来のパツケ
ージを示す斜視図、第４図は従来のパツケージの
外部リードの変形の様子を示す斜視図である。
図において、１，４は外部リード、２は封止樹
脂である。なお、図中、同一符号は同一、又は相
当部分を示す。
FIG. 1 is a perspective view of a package for a semiconductor integrated circuit according to an embodiment of this invention, FIG. 2 is a perspective view showing a lead frame for constructing a package according to an embodiment of this invention, and FIG. 3 is a perspective view of a conventional package. FIG. 4 is a perspective view showing the deformation of the external lead of the conventional package. In the figure, 1 and 4 are external leads, and 2 is a sealing resin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
外部リードの樹脂との境界部のリード幅を他のリ
ードの幅より太くしたことを特徴とする半導体集
積回路用パツケージ。 A semiconductor integrated circuit package characterized in that among external leads pulled out from one side, the lead width at the boundary between the external leads and the resin at both ends is made wider than the width of the other leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14016288U JPH0260257U (en) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14016288U JPH0260257U (en) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260257U true JPH0260257U (en) | 1990-05-02 |
Family
ID=31404084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14016288U Pending JPH0260257U (en) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260257U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143457A (en) * | 1984-08-08 | 1986-03-03 | Hitachi Ltd | Semiconductor device |
-
1988
- 1988-10-26 JP JP14016288U patent/JPH0260257U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143457A (en) * | 1984-08-08 | 1986-03-03 | Hitachi Ltd | Semiconductor device |