JPH0425250U - - Google Patents

Info

Publication number
JPH0425250U
JPH0425250U JP6648190U JP6648190U JPH0425250U JP H0425250 U JPH0425250 U JP H0425250U JP 6648190 U JP6648190 U JP 6648190U JP 6648190 U JP6648190 U JP 6648190U JP H0425250 U JPH0425250 U JP H0425250U
Authority
JP
Japan
Prior art keywords
leads
lead frame
tie bar
semiconductors
boundaries
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6648190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6648190U priority Critical patent/JPH0425250U/ja
Publication of JPH0425250U publication Critical patent/JPH0425250U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図はこの考案の一実施例を示す拡
大図、第3図は従来のリードフレーム全体図、第
4図はその一部拡大図、第5図はリードとタイバ
ーの位置ずれ状態を示す図である。第6図、第7
図はタイバーカツト時の状態を示す図である。図
中、2はリード、3はタイバー、4はタイバーカ
ツトパンチ、5はリードとタイバーの一部連結部
である。なお、図中、同一符号は同一又は相当部
分を示す。
Figures 1 and 2 are enlarged views showing one embodiment of this invention, Figure 3 is an overall view of a conventional lead frame, Figure 4 is a partially enlarged view of the same, and Figure 5 shows misalignment of leads and tie bars. It is a figure showing a state. Figures 6 and 7
The figure shows the state when the tie bar is cut. In the figure, 2 is a lead, 3 is a tie bar, 4 is a tie bar cut punch, and 5 is a partial connecting portion between the lead and the tie bar. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体用リードルレームにおいて、タイバー部
とリードとの境界を一部連結とした事を特徴とす
る半導体用リードフレーム。
A lead frame for semiconductors, characterized in that the boundaries between tie bars and leads are partially connected.
JP6648190U 1990-06-22 1990-06-22 Pending JPH0425250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6648190U JPH0425250U (en) 1990-06-22 1990-06-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6648190U JPH0425250U (en) 1990-06-22 1990-06-22

Publications (1)

Publication Number Publication Date
JPH0425250U true JPH0425250U (en) 1992-02-28

Family

ID=31599243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6648190U Pending JPH0425250U (en) 1990-06-22 1990-06-22

Country Status (1)

Country Link
JP (1) JPH0425250U (en)

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