JPH0468554U - - Google Patents

Info

Publication number
JPH0468554U
JPH0468554U JP11232990U JP11232990U JPH0468554U JP H0468554 U JPH0468554 U JP H0468554U JP 11232990 U JP11232990 U JP 11232990U JP 11232990 U JP11232990 U JP 11232990U JP H0468554 U JPH0468554 U JP H0468554U
Authority
JP
Japan
Prior art keywords
lead frame
lead
frame
lead frames
preventing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11232990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11232990U priority Critical patent/JPH0468554U/ja
Publication of JPH0468554U publication Critical patent/JPH0468554U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のIC用リードフレームの一実
施例のリードフレームが重なり合つた状態を示す
斜視図、第2図は同じく一実施例のカエシを設け
た状態を示すもので、aは正面図、bは側面図、
cは平面図、第3図は同じく一実施例の加工プロ
セスを示す平面図、第4図は同じく一実施例の加
工プロセスを示す断面図である。 1……リードフレーム、2……外枠、3……カ
エシ。
Fig. 1 is a perspective view showing a state in which the lead frames of an embodiment of the IC lead frame of the present invention are overlapped, and Fig. 2 is a perspective view showing the state in which the burrs are provided in the same embodiment. Fig. b is a side view;
c is a plan view, FIG. 3 is a plan view showing the processing process of an embodiment, and FIG. 4 is a sectional view showing the processing process of the embodiment. 1...Lead frame, 2...Outer frame, 3...Kaeshi.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のリードフレームを積み重ねるに際し、各
リードフレーム同志の接触を防止する手段が設け
られているIC用リードフレームにおいて、前記
防止手段が、前記リードフレームの外枠の所定位
置に設けられた短冊状のカエシで形成されたもの
であることを特徴とするIC用リードフレーム。
In an IC lead frame that is provided with a means for preventing contact between the lead frames when stacking a plurality of lead frames, the preventing means is a strip-shaped member provided at a predetermined position on the outer frame of the lead frame. A lead frame for an IC, characterized in that it is made of maple.
JP11232990U 1990-10-26 1990-10-26 Pending JPH0468554U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11232990U JPH0468554U (en) 1990-10-26 1990-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11232990U JPH0468554U (en) 1990-10-26 1990-10-26

Publications (1)

Publication Number Publication Date
JPH0468554U true JPH0468554U (en) 1992-06-17

Family

ID=31859832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11232990U Pending JPH0468554U (en) 1990-10-26 1990-10-26

Country Status (1)

Country Link
JP (1) JPH0468554U (en)

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