JPH01116459U - - Google Patents

Info

Publication number
JPH01116459U
JPH01116459U JP1130288U JP1130288U JPH01116459U JP H01116459 U JPH01116459 U JP H01116459U JP 1130288 U JP1130288 U JP 1130288U JP 1130288 U JP1130288 U JP 1130288U JP H01116459 U JPH01116459 U JP H01116459U
Authority
JP
Japan
Prior art keywords
cutting blade
view
lead frame
separating
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1130288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1130288U priority Critical patent/JPH01116459U/ja
Publication of JPH01116459U publication Critical patent/JPH01116459U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Punching Or Piercing (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示す正面図、第
2図はその側面図、第3図はこの考案の切刃部を
示す平面図、第4図はその正面図、第5図はその
側面図、第6図はリードフレームの平面図、第7
図はその側面図、第8図はプレスの正面図、第9
図は従来装置の斜視図、第10図は切断后のリー
ドフレームを示す平面図である。 図中、10は切刃部、11は切刃保持部である
。なお各図中同一符号は同一又は相当部分を示す
Fig. 1 is a front view showing an embodiment of this invention, Fig. 2 is a side view thereof, Fig. 3 is a plan view showing the cutting edge portion of this invention, Fig. 4 is a front view thereof, and Fig. 5 is Its side view, Fig. 6 is a plan view of the lead frame, Fig. 7
The figure is a side view, Figure 8 is a front view of the press, and Figure 9 is a front view of the press.
The figure is a perspective view of a conventional device, and FIG. 10 is a plan view showing the lead frame after cutting. In the figure, 10 is a cutting blade part, and 11 is a cutting blade holding part. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置を切刃にてリードフレームより切離
する半導体製造装置において、上記切刃は、切刃
部と切刃保持部とを分離して構成したことを特徴
とする半導体製造装置。
1. A semiconductor manufacturing apparatus in which a semiconductor device is separated from a lead frame by a cutting blade, wherein the cutting blade is configured by separating a cutting blade part and a cutting blade holding part.
JP1130288U 1988-01-29 1988-01-29 Pending JPH01116459U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1130288U JPH01116459U (en) 1988-01-29 1988-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1130288U JPH01116459U (en) 1988-01-29 1988-01-29

Publications (1)

Publication Number Publication Date
JPH01116459U true JPH01116459U (en) 1989-08-07

Family

ID=31219735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1130288U Pending JPH01116459U (en) 1988-01-29 1988-01-29

Country Status (1)

Country Link
JP (1) JPH01116459U (en)

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