JPH0295238U - - Google Patents
Info
- Publication number
- JPH0295238U JPH0295238U JP398489U JP398489U JPH0295238U JP H0295238 U JPH0295238 U JP H0295238U JP 398489 U JP398489 U JP 398489U JP 398489 U JP398489 U JP 398489U JP H0295238 U JPH0295238 U JP H0295238U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die
- top surface
- processing mold
- lead processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
Description
第１図はこの考案の一実施例を示す断面図、第
２図は、その動作状態を示す断面図、第３図は従
来装置を示す断面図、第４図はその動作状態を示
す断面図である。
図中、４０はダイスペーサ、４０ａは平面部、
４０ｂはテーパ部である。なお図中、同一符号は
同一、又は相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a sectional view showing its operating state, Fig. 3 is a sectional view showing a conventional device, and Fig. 4 is a sectional view showing its operating state. It is. In the figure, 40 is a die spacer, 40a is a flat part,
40b is a tapered portion. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
決めするダイスペーサを有する半導体装置用リー
ド加工金型において、ダイスペーサの上面を、パ
ツケージ下面に近接させて平面状に構成すると共
に、上記上面の両側を下面方向へテーパ状に構成
したことを特徴とする半導体装置用リード加工金
型。 In a semiconductor device lead processing mold having a die spacer placed between cutting dies and for positioning the cutting die, the die spacer has a top surface close to the bottom surface of the package and configured in a flat shape, and both sides of the top surface are arranged as a bottom surface. A lead processing mold for a semiconductor device characterized by having a tapered shape in the direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP398489U JPH0295238U (en) | 1989-01-18 | 1989-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP398489U JPH0295238U (en) | 1989-01-18 | 1989-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295238U true JPH0295238U (en) | 1990-07-30 |
Family
ID=31206100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP398489U Pending JPH0295238U (en) | 1989-01-18 | 1989-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295238U (en) |
-
1989
- 1989-01-18 JP JP398489U patent/JPH0295238U/ja active Pending