JPS6452250U - - Google Patents
Info
- Publication number
- JPS6452250U JPS6452250U JP14704487U JP14704487U JPS6452250U JP S6452250 U JPS6452250 U JP S6452250U JP 14704487 U JP14704487 U JP 14704487U JP 14704487 U JP14704487 U JP 14704487U JP S6452250 U JPS6452250 U JP S6452250U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor
- resin
- die
- punch guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体製造
装置を示す断面側面図、第２図はこの考案を詳細
に示す部分斜視図、第３図は従来の半導体製造装
置を示す断面側面図、第４図はこの装置により加
工される半導体装置の一例構成図である。図中、
９はパンチガイド母台、１０はパンチガイド、１
４はダイ母台、１５はダイである。なお、各図中
同一符号は同一又は相当部分を示す。
FIG. 1 is a cross-sectional side view showing a semiconductor manufacturing apparatus according to an embodiment of this invention, FIG. 2 is a partial perspective view showing this invention in detail, and FIG. 3 is a cross-sectional side view showing a conventional semiconductor manufacturing apparatus. FIG. 4 is a configuration diagram of an example of a semiconductor device processed by this apparatus. In the figure,
9 is a punch guide base, 10 is a punch guide, 1
4 is a die base, and 15 is a die. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
体措置における各リード間のタイバー及び各リー
ド間の樹脂ばりを除去する半導体製造装置におい
て、パンチガイド及びダイの切刃部を分割したこ
とを特徴とする半導体製造装置。 A semiconductor manufacturing device for removing tie bars between each lead and resin burrs between each lead in a semiconductor device in which a semiconductor element on a die pad is resin-sealed, characterized in that the punch guide and the cutting edge of the die are separated. Manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14704487U JPS6452250U (en) | 1987-09-25 | 1987-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14704487U JPS6452250U (en) | 1987-09-25 | 1987-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452250U true JPS6452250U (en) | 1989-03-31 |
Family
ID=31417090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14704487U Pending JPS6452250U (en) | 1987-09-25 | 1987-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452250U (en) |
-
1987
- 1987-09-25 JP JP14704487U patent/JPS6452250U/ja active Pending
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