JPS619299U - Punch for diver cutting type - Google Patents

Punch for diver cutting type

Info

Publication number
JPS619299U
JPS619299U JP9102984U JP9102984U JPS619299U JP S619299 U JPS619299 U JP S619299U JP 9102984 U JP9102984 U JP 9102984U JP 9102984 U JP9102984 U JP 9102984U JP S619299 U JPS619299 U JP S619299U
Authority
JP
Japan
Prior art keywords
punch
cutting type
diver
breaking
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9102984U
Other languages
Japanese (ja)
Inventor
芳修 時崎
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9102984U priority Critical patent/JPS619299U/en
Publication of JPS619299U publication Critical patent/JPS619299U/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１図ａは本考案の代表的実施例の正面図、ｂは側面図
、Ｃは平面図、第２図は従来のタイバ切断型のポンチの
側面図、第３図は従来のポンチの摩耗状態を表わす側面
図とワークである半導体装置の１部断面図を含む側面図
である。 １ａ・・・・・・樹脂破断用ポンチ、２ａ・・・・・・
タイバ切断用ポンチ。[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1a is a front view of a typical embodiment of the present invention, b is a side view, C is a plan view, Fig. 2 is a side view of a conventional tie bar cutting type punch, and Fig. 3 is a front view of a typical embodiment of the present invention. The figure is a side view showing the state of wear of a conventional punch and a side view including a partial sectional view of a semiconductor device as a workpiece. 1a...Punch for resin breaking, 2a...
Punch for cutting tie bars.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置の樹脂ばりを破断させる樹脂破断用ポンチを
一様な断面形状を有する棒状に形成し、該樹脂破断用ポ
ンチを、リードフレームのダイバ切断用ポンチのシャン
クに移動調整可能に支持させたことを特徴とするダイバ
切断型用ポンチ。A resin breaking punch for breaking resin burrs on a semiconductor device is formed into a rod shape having a uniform cross-sectional shape, and the resin breaking punch is movably supported by the shank of a diver cutting punch for a lead frame. Diver cutting type punch featuring:
JP9102984U 1984-06-19 1984-06-19 Punch for diver cutting type Pending JPS619299U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9102984U JPS619299U (en) 1984-06-19 1984-06-19 Punch for diver cutting type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9102984U JPS619299U (en) 1984-06-19 1984-06-19 Punch for diver cutting type

Publications (1)

Publication Number Publication Date
JPS619299U true JPS619299U (en) 1986-01-20

Family

ID=30646558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9102984U Pending JPS619299U (en) 1984-06-19 1984-06-19 Punch for diver cutting type

Country Status (1)

Country Link
JP (1) JPS619299U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123339U (en) * 1988-02-16 1989-08-22
JPH02148745A (en) * 1988-11-29 1990-06-07 Toshiba Corp Positioning device for lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123339U (en) * 1988-02-16 1989-08-22
JPH02148745A (en) * 1988-11-29 1990-06-07 Toshiba Corp Positioning device for lead frame

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