JPS6442731U - - Google Patents

Info

Publication number
JPS6442731U
JPS6442731U JP13536187U JP13536187U JPS6442731U JP S6442731 U JPS6442731 U JP S6442731U JP 13536187 U JP13536187 U JP 13536187U JP 13536187 U JP13536187 U JP 13536187U JP S6442731 U JPS6442731 U JP S6442731U
Authority
JP
Japan
Prior art keywords
punch
die
tip
shows
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13536187U
Other languages
Japanese (ja)
Other versions
JPH0340420Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987135361U priority Critical patent/JPH0340420Y2/ja
Publication of JPS6442731U publication Critical patent/JPS6442731U/ja
Application granted granted Critical
Publication of JPH0340420Y2 publication Critical patent/JPH0340420Y2/ja
Expired legal-status Critical Current

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  • Punching Or Piercing (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案実施例のパンチをダイに対向さ
せた状態を示し、第2図は突出部の作用を説明す
るための図であり、第3図はタイバーを切断して
いる状態を示し、第4図は本考案のパンチを使用
して製造されるリードフレームの形状を示す。他
方、第5図は従来のパンチ及びその欠点を説明す
るための図であり、第6図は樹脂封止された半導
体装置のパツケージの側面から突出しているアウ
ターリード及びそのアウターリードを従来のパン
チにより切断した状態を示す図である。 1:パンチ、2:ダイ、3:孔部、4:ずれ、
5:パツケージ、6:アウターリード、7:タイ
バー、8:サイドバー、9:突出部、10:切込
み、11:パンチの突出部、12:切り刃部、1
3:傾斜面、14:パツド、15:電極部、16
:サポートバー。
Figure 1 shows the punch according to the embodiment of the present invention facing the die, Figure 2 is a diagram for explaining the action of the protrusion, and Figure 3 shows the tie bar being cut. , FIG. 4 shows the shape of a lead frame manufactured using the punch of the present invention. On the other hand, FIG. 5 is a diagram for explaining a conventional punch and its drawbacks, and FIG. 6 shows an outer lead protruding from the side of a package of a resin-sealed semiconductor device and a conventional punch. It is a figure which shows the state cut by. 1: Punch, 2: Die, 3: Hole, 4: Misalignment,
5: Package cage, 6: Outer lead, 7: Tie bar, 8: Side bar, 9: Projection, 10: Notch, 11: Punch projection, 12: Cutting blade, 1
3: Inclined surface, 14: Pad, 15: Electrode part, 16
: Support bar.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイ側へ向かつて延びる突出部が先端部の一部
に設けられ、前記突出部の先端にテーパを付け、
ダイの孔部に対するガイドとしたことを特徴とす
る打抜き加工用パンチ。
A protrusion extending toward the die side is provided at a part of the tip, and the tip of the protrusion is tapered,
A punch for punching, characterized in that it serves as a guide for a hole in a die.
JP1987135361U 1987-09-03 1987-09-03 Expired JPH0340420Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987135361U JPH0340420Y2 (en) 1987-09-03 1987-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987135361U JPH0340420Y2 (en) 1987-09-03 1987-09-03

Publications (2)

Publication Number Publication Date
JPS6442731U true JPS6442731U (en) 1989-03-14
JPH0340420Y2 JPH0340420Y2 (en) 1991-08-26

Family

ID=31394917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987135361U Expired JPH0340420Y2 (en) 1987-09-03 1987-09-03

Country Status (1)

Country Link
JP (1) JPH0340420Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182724U (en) * 1984-11-02 1986-05-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182724U (en) * 1984-11-02 1986-05-31

Also Published As

Publication number Publication date
JPH0340420Y2 (en) 1991-08-26

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