JPH0381637U - - Google Patents
Info
- Publication number
- JPH0381637U JPH0381637U JP14198989U JP14198989U JPH0381637U JP H0381637 U JPH0381637 U JP H0381637U JP 14198989 U JP14198989 U JP 14198989U JP 14198989 U JP14198989 U JP 14198989U JP H0381637 U JPH0381637 U JP H0381637U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer mounting
- dicing
- spacer
- mounting film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図はこの考案の一実施例におけるダイシン
グ用ウエハ載置台を示す平面図、第２図は第１図
の−線に沿う断面図、第３図は従来のダイシ
ング用ウエハ載置台の一例を示す平面図、第４図
は第３図の−線に沿う断面図である。
１……フレーム、２……ウエハ載置膜、３……
ウエハ、４……切断線、５……スペーサ、６……
空隙。
Fig. 1 is a plan view showing a wafer mounting table for dicing according to an embodiment of this invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, and Fig. 3 is an example of a conventional wafer mounting table for dicing. The plan view shown in FIG. 4 is a sectional view taken along the - line in FIG. 3. 1...Frame, 2...Wafer mounting film, 3...
Wafer, 4... Cutting line, 5... Spacer, 6...
void.
Claims (1)
られ、このウエハ載置膜上に、上面にダイシング
の目安となる切断線が形成されたウエハが載置さ
れるダイシング用ウエハ載置台において、 前記ウエハ載置膜の上面において、前記ウエハ
の切断線と対応する部分を除く部分に、スペーサ
を設け、このスペーサ上に前記ウエハを載置する
ようにしたことを特徴とするダイシング用ウエハ
載置台。[Claims for Utility Model Registration] For dicing, in which a wafer mounting film is attached to a ring-shaped frame, and a wafer with cutting lines formed on the upper surface that serves as a guide for dicing is placed on the wafer mounting film. In the wafer mounting table, a spacer is provided on the upper surface of the wafer mounting film except for a portion corresponding to a cutting line of the wafer, and the wafer is mounted on the spacer. Wafer mounting table for dicing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14198989U JPH0381637U (en) | 1989-12-11 | 1989-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14198989U JPH0381637U (en) | 1989-12-11 | 1989-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381637U true JPH0381637U (en) | 1991-08-21 |
Family
ID=31688842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14198989U Pending JPH0381637U (en) | 1989-12-11 | 1989-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381637U (en) |
-
1989
- 1989-12-11 JP JP14198989U patent/JPH0381637U/ja active Pending