JPS6275067U - - Google Patents
Info
- Publication number
- JPS6275067U JPS6275067U JP16602785U JP16602785U JPS6275067U JP S6275067 U JPS6275067 U JP S6275067U JP 16602785 U JP16602785 U JP 16602785U JP 16602785 U JP16602785 U JP 16602785U JP S6275067 U JPS6275067 U JP S6275067U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- precious metal
- mask plate
- metal plating
- embankment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000010970 precious metal Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは、本考案の部分めつき用マスク
板の二種の実施例を示す平面図であり、第２図ａ
〜ｄは、本考案の部分めつき用マスク板の種々の
実施例を示す部分断面図であり、第３図は、リー
ドフレームへの部分めつきの様子を示す説明図で
ある。
１…下マスク、１ａ…堤防状の突起部、１ｂ…
クツシヨン材、１ｃ…下マスク基材、２…開口部
、３…リードフレーム、３ａ…アイランド部、３
ｂ…インナーリード先端部、４…上マスク、５…
ノズルまたはスリツト、６…貴金属めつき液、７
…貴金属めつき膜。
FIGS. 1a and 1b are plan views showing two embodiments of the mask plate for partial plating of the present invention, and FIG.
-d are partial cross-sectional views showing various embodiments of the mask plate for partial plating of the present invention, and FIG. 3 is an explanatory view showing how partial plating is performed on a lead frame. 1... Lower mask, 1a... Embankment-like protrusion, 1b...
Cushion material, 1c... Lower mask base material, 2... Opening, 3... Lead frame, 3a... Island part, 3
b... Inner lead tip, 4... Upper mask, 5...
Nozzle or slit, 6... Precious metal plating liquid, 7
...Precious metal plating film.
Claims (1)
うに堤防状の突起１ａを少なくとも１条設けたＩ
Ｃリードフレームの部分貴金属めつき用マスク板
。 At least one embankment-like protrusion 1a is provided near the opening 2 of the cushion material so as to surround it.
Mask plate for partial precious metal plating of C lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602785U JPS6275067U (en) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602785U JPS6275067U (en) | 1985-10-29 | 1985-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6275067U true JPS6275067U (en) | 1987-05-14 |
Family
ID=31096610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16602785U Pending JPS6275067U (en) | 1985-10-29 | 1985-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6275067U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101250377B1 (en) | 2011-10-24 | 2013-04-05 | 엘지이노텍 주식회사 | The jig for electroplating and jig apparatus using the same |
| WO2023157329A1 (en) * | 2022-02-21 | 2023-08-24 | Ｄｏｗａメタルテック株式会社 | Mask member for partial plating and partial plating method |
-
1985
- 1985-10-29 JP JP16602785U patent/JPS6275067U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101250377B1 (en) | 2011-10-24 | 2013-04-05 | 엘지이노텍 주식회사 | The jig for electroplating and jig apparatus using the same |
| WO2023157329A1 (en) * | 2022-02-21 | 2023-08-24 | Ｄｏｗａメタルテック株式会社 | Mask member for partial plating and partial plating method |