JPS62163962U - - Google Patents

Info

Publication number
JPS62163962U
JPS62163962U JP5156586U JP5156586U JPS62163962U JP S62163962 U JPS62163962 U JP S62163962U JP 5156586 U JP5156586 U JP 5156586U JP 5156586 U JP5156586 U JP 5156586U JP S62163962 U JPS62163962 U JP S62163962U
Authority
JP
Japan
Prior art keywords
concave
marker
bonded
serves
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5156586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5156586U priority Critical patent/JPS62163962U/ja
Publication of JPS62163962U publication Critical patent/JPS62163962U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す平面図であ
る。 １…ダイアイランド、２…凹部あるいは凸部の
標識、３…チツプ。 FIG. 1 is a plan view showing an embodiment of this invention. 1...Die island, 2...Indicator of concave or convex part, 3...Tip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイアイランドの表面に、接着するチツプの位
置決めの標識となる凹部あるいは凸部を有するリ
ードフレーム。 A lead frame that has a concave or convex portion on the surface of the die island that serves as a marker for positioning the chip to be bonded.
JP5156586U 1986-04-08 1986-04-08 Pending JPS62163962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5156586U JPS62163962U (en) 1986-04-08 1986-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5156586U JPS62163962U (en) 1986-04-08 1986-04-08

Publications (1)

Publication Number Publication Date
JPS62163962U true JPS62163962U (en) 1987-10-17

Family

ID=30875945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5156586U Pending JPS62163962U (en) 1986-04-08 1986-04-08

Country Status (1)

Country Link
JP (1) JPS62163962U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012253390A (en) * 2012-09-24 2012-12-20 Renesas Electronics Corp Manufacturing method of semiconductor device
JP2017199823A (en) * 2016-04-28 2017-11-02 株式会社ジェイデバイス Semiconductor package and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127047A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Resin-sealed semiconductor device
JPS5623896U (en) * 1979-07-30 1981-03-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127047A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Resin-sealed semiconductor device
JPS5623896U (en) * 1979-07-30 1981-03-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012253390A (en) * 2012-09-24 2012-12-20 Renesas Electronics Corp Manufacturing method of semiconductor device
JP2017199823A (en) * 2016-04-28 2017-11-02 株式会社ジェイデバイス Semiconductor package and method of manufacturing the same

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