JPS62120364U - - Google Patents
Info
- Publication number
- JPS62120364U JPS62120364U JP859486U JP859486U JPS62120364U JP S62120364 U JPS62120364 U JP S62120364U JP 859486 U JP859486 U JP 859486U JP 859486 U JP859486 U JP 859486U JP S62120364 U JPS62120364 U JP S62120364U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tie bar
- view
- lead frame
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す平面図、第
２図はその斜視図、第３図はこの考案の他の実施
例を示す平面図、第４図はこの考案の更に他の実
施例を示す平面図、第５図はその―線におけ
る断面図、第６図は従来のリードフレームを示す
平面図、第７図はその拡大図、第８図は従来のリ
ードフレームの折曲状態を示す斜視図、第９図は
従来のリードフレームの他の例を示す拡大平面図
である。
図中、１はリード片、１ａ，１ｃは外部リード
片、２はタイバー、３は封止樹脂、４は切断部、
８は切欠部、９はリードフレーム、１０は穴、１
１は溝である。なお図中、同一符号は同一、又は
相当部分を示す。
Fig. 1 is a plan view showing one embodiment of this invention, Fig. 2 is a perspective view thereof, Fig. 3 is a plan view showing another embodiment of this invention, and Fig. 4 is a plan view showing another embodiment of this invention. A plan view showing an example, FIG. 5 is a sectional view taken along the line, FIG. 6 is a plan view showing a conventional lead frame, FIG. 7 is an enlarged view thereof, and FIG. 8 is a bent state of the conventional lead frame. FIG. 9 is an enlarged plan view showing another example of a conventional lead frame. In the figure, 1 is a lead piece, 1a and 1c are external lead pieces, 2 is a tie bar, 3 is a sealing resin, 4 is a cutting part,
8 is a notch, 9 is a lead frame, 10 is a hole, 1
1 is a groove. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
タイバーを起点とし、このタイバーから内側のリ
ード片における外部リード片の略折曲げ位置のみ
の断面積を局部的に小さくしたことを特徴とする
半導体装置用リードフレーム。 In lead frames for sealed semiconductor devices,
1. A lead frame for a semiconductor device, starting from a tie bar, and having a locally reduced cross-sectional area only at a substantially bending position of an external lead piece in a lead piece inside from the tie bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP859486U JPS62120364U (en) | 1986-01-22 | 1986-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP859486U JPS62120364U (en) | 1986-01-22 | 1986-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62120364U true JPS62120364U (en) | 1987-07-30 |
Family
ID=30793117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP859486U Pending JPS62120364U (en) | 1986-01-22 | 1986-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62120364U (en) |
-
1986
- 1986-01-22 JP JP859486U patent/JPS62120364U/ja active Pending