JPS636747U - - Google Patents
Info
- Publication number
- JPS636747U JPS636747U JP10044086U JP10044086U JPS636747U JP S636747 U JPS636747 U JP S636747U JP 10044086 U JP10044086 U JP 10044086U JP 10044086 U JP10044086 U JP 10044086U JP S636747 U JPS636747 U JP S636747U
- Authority
- JP
- Japan
- Prior art keywords
- sides
- leads
- resin
- semiconductor device
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示すもので、ａ
は平面図、ｂは正面図、第２図は従来の半導体装
置用のフレームを示すもので、ａは平面図、ｂは
正面図である。
図中、１は樹脂部、２，３，４はリードである
。尚、図中同一符号は同一または相当部分を示す
。
Figure 1 shows an embodiment of this invention.
2 is a plan view, b is a front view, and FIG. 2 shows a conventional frame for a semiconductor device, where a is a plan view and b is a front view. In the figure, 1 is a resin part, and 2, 3, and 4 are leads. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
各々本数が異なるリードを有するものにおいて、
上記両側のリードの曲げ加工を施こす部分のリー
ド断面積を左右で同じく設定したことを特徴とす
る半導体装置用フレーム。 In resin-encapsulated semiconductor devices that have different numbers of leads on the left and right sides of the resin side surface,
A frame for a semiconductor device, characterized in that the lead cross-sectional area of the portion where the leads on both sides are bent is set to be the same on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10044086U JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10044086U JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636747U true JPS636747U (en) | 1988-01-18 |
| JPH08762Y2 JPH08762Y2 (en) | 1996-01-10 |
Family
ID=30970265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10044086U Expired - Lifetime JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08762Y2 (en) |
-
1986
- 1986-06-30 JP JP10044086U patent/JPH08762Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08762Y2 (en) | 1996-01-10 |