JPH0275747U - - Google Patents
Info
- Publication number
- JPH0275747U JPH0275747U JP15576088U JP15576088U JPH0275747U JP H0275747 U JPH0275747 U JP H0275747U JP 15576088 U JP15576088 U JP 15576088U JP 15576088 U JP15576088 U JP 15576088U JP H0275747 U JPH0275747 U JP H0275747U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- leads
- integrated circuit
- lead
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示すリードフレー
ムの部分平面図、第２図は従来のリードフレーム
の部分平面図である。
１…リードフレーム、２…アイランド、３…リ
ード、４…タイバー、５…樹脂テープ。
FIG. 1 is a partial plan view of a lead frame showing an embodiment of the present invention, and FIG. 2 is a partial plan view of a conventional lead frame. 1...Lead frame, 2...Island, 3...Lead, 4...Tie bar, 5...Resin tape.
Claims (1)
て、複数のリードがこのリード面上に貼り渡され
た樹脂テープによつて一体に固定されていること
を特徴とするリードフレーム。 A lead frame for use in an integrated circuit device, characterized in that a plurality of leads are integrally fixed by a resin tape pasted over the lead surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576088U JPH0275747U (en) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576088U JPH0275747U (en) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275747U true JPH0275747U (en) | 1990-06-11 |
Family
ID=31433671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15576088U Pending JPH0275747U (en) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275747U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336459A (en) * | 1991-05-13 | 1992-11-24 | Fuji Plant Kogyo Kk | Lead frame requiring no deflashing and fabrication thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151933A (en) * | 1984-08-22 | 1986-03-14 | Hitachi Ltd | Manufacture of semiconductor device |
-
1988
- 1988-11-29 JP JP15576088U patent/JPH0275747U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151933A (en) * | 1984-08-22 | 1986-03-14 | Hitachi Ltd | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336459A (en) * | 1991-05-13 | 1992-11-24 | Fuji Plant Kogyo Kk | Lead frame requiring no deflashing and fabrication thereof |
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