JPH0231147U - - Google Patents
Info
- Publication number
- JPH0231147U JPH0231147U JP10906388U JP10906388U JPH0231147U JP H0231147 U JPH0231147 U JP H0231147U JP 10906388 U JP10906388 U JP 10906388U JP 10906388 U JP10906388 U JP 10906388U JP H0231147 U JPH0231147 U JP H0231147U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- semiconductor device
- lead
- substrate
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１実施例の半導体装置の基
板搭載後の側面図、第２図は本考案の第２実施例
の半導体装置の基板搭載後の側面図、第３図は従
来の半導体装置の基板搭載部の側面図である。
１，１Ａ……半導体装置、２，２Ａ……封止樹
脂、３，３Ａ……外部引出しリード、３ａ……階
段部、４……基板、５……半田。
FIG. 1 is a side view of a semiconductor device according to a first embodiment of the present invention after it is mounted on a substrate, FIG. 2 is a side view of a semiconductor device according to a second embodiment of this invention after it is mounted on a substrate, and FIG. FIG. 2 is a side view of a substrate mounting section of a semiconductor device. 1, 1A... Semiconductor device, 2, 2A... Sealing resin, 3, 3A... External lead, 3a... Stairs, 4... Substrate, 5... Solder.
Claims (1)
を有し、かつこの外部引出しリードを半田等によ
り基板に接続する半導体装置において、前記外部
引出しリードの中間の少なくとも一部に、リード
を階段状に曲げ成形した階段部を備えたことを特
徴とする半導体装置。 In a semiconductor device that has a short external lead protruding from a sealing resin and connects this external lead to a substrate by soldering or the like, the lead is bent into a step shape at least in a part of the middle of the external lead. A semiconductor device characterized by having a molded staircase portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906388U JPH0231147U (en) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906388U JPH0231147U (en) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231147U true JPH0231147U (en) | 1990-02-27 |
Family
ID=31344971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10906388U Pending JPH0231147U (en) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231147U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015220270A (en) * | 2014-05-15 | 2015-12-07 | ローム株式会社 | Mounting package for double-sided connection |
-
1988
- 1988-08-22 JP JP10906388U patent/JPH0231147U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015220270A (en) * | 2014-05-15 | 2015-12-07 | ローム株式会社 | Mounting package for double-sided connection |