JPH0336141U - - Google Patents
Info
- Publication number
- JPH0336141U JPH0336141U JP9807589U JP9807589U JPH0336141U JP H0336141 U JPH0336141 U JP H0336141U JP 9807589 U JP9807589 U JP 9807589U JP 9807589 U JP9807589 U JP 9807589U JP H0336141 U JPH0336141 U JP H0336141U
- Authority
- JP
- Japan
- Prior art keywords
- package structure
- utility
- electronic components
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体素子
のパツケージ構造を示す断面側面図、第２図は第
１図のモールド樹脂による突起部の拡大斜視図、
第３図は従来の半導体素子のパツケージ構造を示
す斜視図を示す。
１……半導体素子を封止するためのモールド樹
脂、２……外部リード端子、３……モールド樹脂
による突起部。なお、図中、同一符号は同一、ま
たは相当部分を示す。
FIG. 1 is a cross-sectional side view showing a package structure of a semiconductor element according to an embodiment of the invention, FIG. 2 is an enlarged perspective view of a protrusion made of mold resin in FIG.
FIG. 3 is a perspective view showing the package structure of a conventional semiconductor device. 1...Mold resin for sealing the semiconductor element, 2...External lead terminal, 3...Protrusion portion made of mold resin. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
止形状部を設けたことを特徴とする電子部品のパ
ツケージ構造。 A package structure for electronic components, characterized in that a molded resin part between terminal leads is provided with a shaped part to prevent solder conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9807589U JPH0336141U (en) | 1989-08-22 | 1989-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9807589U JPH0336141U (en) | 1989-08-22 | 1989-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336141U true JPH0336141U (en) | 1991-04-09 |
Family
ID=31647192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9807589U Pending JPH0336141U (en) | 1989-08-22 | 1989-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336141U (en) |
-
1989
- 1989-08-22 JP JP9807589U patent/JPH0336141U/ja active Pending