JPS63102254U - - Google Patents
Info
- Publication number
- JPS63102254U JPS63102254U JP19719186U JP19719186U JPS63102254U JP S63102254 U JPS63102254 U JP S63102254U JP 19719186 U JP19719186 U JP 19719186U JP 19719186 U JP19719186 U JP 19719186U JP S63102254 U JPS63102254 U JP S63102254U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- heat sink
- main terminal
- control
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Description
第１図は本考案の一実施例を示すもので、第１
図ａは上面図、第１図ｂは側面図である。第２図
ａは第１図に示した実施例の等価回路図、第２図
ｂは他の実施例の等価回路図である。第３図は樹
脂モールド形半導体制御素子の一例を示すもので
、第３図ａは上面図、第３図ｂは側面図である。
１……放熱板、２……制御端子、３……主端子
、４……半導体制御素子片、５……サージ吸収素
子、６……モールド樹脂、７……導線。
Figure 1 shows one embodiment of the present invention.
Figure a is a top view, and Figure 1b is a side view. FIG. 2a is an equivalent circuit diagram of the embodiment shown in FIG. 1, and FIG. 2b is an equivalent circuit diagram of another embodiment. FIG. 3 shows an example of a resin molded semiconductor control element, with FIG. 3a being a top view and FIG. 3b being a side view. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Control terminal, 3... Main terminal, 4... Semiconductor control element piece, 5... Surge absorbing element, 6... Molding resin, 7... Leading wire.
Claims (1)
兼ねた放熱板を備えた３端子半導体制御素子の、
主端子と放熱板との間または制御端子と放熱板と
の間に、リードレスタイプのサージ吸収素子を接
続固着し、一体として樹脂モールドされているこ
とを特徴とする半導体装置。 A three-terminal semiconductor control element that has one main terminal, a control terminal, and a heat sink that also serves as the other main terminal.
A semiconductor device characterized in that a leadless type surge absorbing element is connected and fixed between a main terminal and a heat sink or between a control terminal and a heat sink, and is integrally molded with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19719186U JPS63102254U (en) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19719186U JPS63102254U (en) | 1986-12-22 | 1986-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102254U true JPS63102254U (en) | 1988-07-02 |
Family
ID=31156690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19719186U Pending JPS63102254U (en) | 1986-12-22 | 1986-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102254U (en) |
-
1986
- 1986-12-22 JP JP19719186U patent/JPS63102254U/ja active Pending