JPH0320448U - - Google Patents

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Publication number
JPH0320448U
JPH0320448U JP8098589U JP8098589U JPH0320448U JP H0320448 U JPH0320448 U JP H0320448U JP 8098589 U JP8098589 U JP 8098589U JP 8098589 U JP8098589 U JP 8098589U JP H0320448 U JPH0320448 U JP H0320448U
Authority
JP
Japan
Prior art keywords
input
output terminal
mounting part
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8098589U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8098589U priority Critical patent/JPH0320448U/ja
Publication of JPH0320448U publication Critical patent/JPH0320448U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体集積回路装置の一実施
例を示す斜視図、第2図はその入出力端子の取付
部分を拡大して示した拡大斜視図、第3図は第1
図、第2図の装置の断面構成図、第4図は本考案
の別の実施例を示す断面構成図、第5図は従来の
半導体集積回路装置の断面構成図である。 1……入出力端子、2……入出力端子の取付部
分、3……絶縁性樹脂封止部、4……入出力端子
間の空間、5……ICチツプ、6……ワイヤー。
FIG. 1 is a perspective view showing an embodiment of the semiconductor integrated circuit device of the present invention, FIG. 2 is an enlarged perspective view showing the mounting portion of the input/output terminals, and FIG.
2, FIG. 4 is a cross-sectional view showing another embodiment of the present invention, and FIG. 5 is a cross-sectional view of a conventional semiconductor integrated circuit device. DESCRIPTION OF SYMBOLS 1...Input/output terminal, 2...Input/output terminal mounting part, 3...Insulating resin sealing part, 4...Space between input and output terminals, 5...IC chip, 6...Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 入出力用端子の取付部分またはそれに接する部
分における各入出力端子間の空間に絶縁性物質を
配したことを特徴とする半導体集積回路装置。
1. A semiconductor integrated circuit device characterized in that an insulating material is arranged in the space between each input/output terminal in a mounting part of the input/output terminal or a part in contact with the mounting part of the input/output terminal.
JP8098589U 1989-07-10 1989-07-10 Pending JPH0320448U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8098589U JPH0320448U (en) 1989-07-10 1989-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8098589U JPH0320448U (en) 1989-07-10 1989-07-10

Publications (1)

Publication Number Publication Date
JPH0320448U true JPH0320448U (en) 1991-02-28

Family

ID=31626518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8098589U Pending JPH0320448U (en) 1989-07-10 1989-07-10

Country Status (1)

Country Link
JP (1) JPH0320448U (en)

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