JPS63157144U - - Google Patents
Info
- Publication number
- JPS63157144U JPS63157144U JP4928187U JP4928187U JPS63157144U JP S63157144 U JPS63157144 U JP S63157144U JP 4928187 U JP4928187 U JP 4928187U JP 4928187 U JP4928187 U JP 4928187U JP S63157144 U JPS63157144 U JP S63157144U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- reed switch
- reed
- semiconductor device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Description
第１図は本考案のリードリレーの一実施例を示
す破断斜視図、第２図は従来のリードリレーの一
例を示す破断斜視図である。
１…半導体装置、２…リードフレーム中吊り部
、３ａ，３ｂ，３ｃ，３ｄ…中継端子部、４ａ，
４ｂ，４ｃ，４ｄ…リード線、５…第１のエポキ
シ系モールド成形樹脂、６…コイル、７ａ，７ｂ
，７ｃ…リレー入出力端子、８…第２のエポキシ
系モールド成形樹脂、９…デイスクリート部品、
１０…プリント基板、１１…リードスイツチ端子
、１２…リード線、１３…基板配線、１４…ケー
ス。
FIG. 1 is a cutaway perspective view showing an embodiment of the reed relay of the present invention, and FIG. 2 is a cutaway perspective view showing an example of a conventional reed relay. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 2...Hanging part in lead frame, 3a, 3b, 3c, 3d...Relay terminal part, 4a,
4b, 4c, 4d... Lead wire, 5... First epoxy molding resin, 6... Coil, 7a, 7b
, 7c...Relay input/output terminal, 8...Second epoxy molding resin, 9...Discrete parts,
DESCRIPTION OF SYMBOLS 10... Printed circuit board, 11... Reed switch terminal, 12... Lead wire, 13... Board wiring, 14... Case.
Claims (1)
、リードスイツチと、前記コイルの駆動電流の制
御および前記リードスイツチの接点信号の処理の
少なくともいずれかを行う半導体装置とを第１の
モールド成形樹脂により固定保持したのち前記コ
イルおよびリードスイツチと共に第２のモールド
成形樹脂により外装してなることを特徴とするリ
ードリレー。 A coil disposed on the same lead frame, a reed switch, and a semiconductor device that performs at least one of controlling the drive current of the coil and processing the contact signal of the reed switch are formed using a first molding resin. A reed relay characterized in that after being fixedly held, the coil and reed switch are covered with a second molded resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4928187U JPS63157144U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4928187U JPS63157144U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157144U true JPS63157144U (en) | 1988-10-14 |
Family
ID=30871585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4928187U Pending JPS63157144U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157144U (en) |
-
1987
- 1987-03-31 JP JP4928187U patent/JPS63157144U/ja active Pending
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