JPH02132944U - - Google Patents
Info
- Publication number
- JPH02132944U JPH02132944U JP4176489U JP4176489U JPH02132944U JP H02132944 U JPH02132944 U JP H02132944U JP 4176489 U JP4176489 U JP 4176489U JP 4176489 U JP4176489 U JP 4176489U JP H02132944 U JPH02132944 U JP H02132944U
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- mounting hole
- element mounting
- lead frame
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案による絶縁型半導体素子の外観
を示す斜視図、第２図は本考案による樹脂封止装
置の第１の実施例を示す断面図、第３図は従来に
おける絶縁型半導体素子の外観を示す斜視図、第
４図は従来の樹脂封止装置の断面図、第５図は本
考案による樹脂封止装置の第２の実施例を示す断
面図である。
１ａ……上金型、１ｂ……下金型、２……リー
ドフレーム、３……コアピン、４……凸部、５…
…凹部、６……ねじ取付穴、７……半導体ペレツ
ト、８……未充填、９……リードフレーム凸部。
FIG. 1 is a perspective view showing the external appearance of an insulated semiconductor device according to the present invention, FIG. 2 is a sectional view showing a first embodiment of a resin sealing device according to the present invention, and FIG. 3 is a conventional insulated semiconductor device. FIG. 4 is a cross-sectional view of a conventional resin sealing device, and FIG. 5 is a cross-sectional view showing a second embodiment of the resin sealing device according to the present invention. 1a... Upper mold, 1b... Lower mold, 2... Lead frame, 3... Core pin, 4... Convex part, 5...
...Recessed portion, 6...Screw mounting hole, 7...Semiconductor pellet, 8...Unfilled, 9...Lead frame protrusion.
Claims (1)
穴近傍の金型に２箇所の凸部を設けるかあるいは
素子取付穴近傍のリードフレームに凸部を設けて
樹脂封止することを特徴とする絶縁型半導体素子
の樹脂封止装置。 An insulated type resin sealing device for a semiconductor element, characterized in that two protrusions are provided on the mold near the element mounting hole, or a protrusion is provided on the lead frame near the element mounting hole for resin sealing. Resin sealing equipment for semiconductor elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176489U JPH02132944U (en) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176489U JPH02132944U (en) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132944U true JPH02132944U (en) | 1990-11-05 |
Family
ID=31552712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176489U Pending JPH02132944U (en) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020123691A (en) * | 2019-01-31 | 2020-08-13 | 株式会社三社電機製作所 | Semiconductor product |
-
1989
- 1989-04-10 JP JP4176489U patent/JPH02132944U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020123691A (en) * | 2019-01-31 | 2020-08-13 | 株式会社三社電機製作所 | Semiconductor product |
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