JPS6360312U - - Google Patents
Info
- Publication number
- JPS6360312U JPS6360312U JP15225186U JP15225186U JPS6360312U JP S6360312 U JPS6360312 U JP S6360312U JP 15225186 U JP15225186 U JP 15225186U JP 15225186 U JP15225186 U JP 15225186U JP S6360312 U JPS6360312 U JP S6360312U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- width
- upper mold
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図ａは本考案の一実施例の構造を示す断面
図、第１図ｂは本考案の金型で製作した半導体装
置の外観図、第２図ａは従来技術による金型の構
造の一例を示す断面図、第２図ｂは従来の金型で
製作した半導体装置の外観図である。
１……上型キヤビテイブロツク、２……下型キ
ヤビテイブロツク、３……リードフレーム、４…
…電導細線、５……ペレツト、６……上型キヤビ
テイ部、７……下型キヤビテイ部。
FIG. 1a is a sectional view showing the structure of an embodiment of the present invention, FIG. 1b is an external view of a semiconductor device manufactured using the mold of the present invention, and FIG. 2a is the structure of a mold according to the prior art. A cross-sectional view showing one example, FIG. 2b, is an external view of a semiconductor device manufactured using a conventional mold. 1...Upper cavity block, 2...Lower cavity block, 3...Lead frame, 4...
...Thin conductive wire, 5...Pellet, 6...Upper mold cavity part, 7...Lower mold cavity part.
Claims (1)
したリードフレームを上下から挾み込んで構成す
る空間部に樹脂を注入し半導体を樹脂封止する金
型において、上型と下型を分けるパーテイングラ
インをさかいに上型と下型との前記空間部の巾寸
法に寸法差を設けたことを特徴とする樹脂封示用
金型。 In a mold that seals a semiconductor with resin by injecting resin into the space formed by sandwiching a lead frame with pellet mount and wire bonding from above and below, the parting line that separates the upper mold and lower mold is used. A mold for resin sealing, characterized in that the width of the space between the upper mold and the lower mold is different in width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15225186U JPS6360312U (en) | 1986-10-02 | 1986-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15225186U JPS6360312U (en) | 1986-10-02 | 1986-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6360312U true JPS6360312U (en) | 1988-04-21 |
Family
ID=31070060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15225186U Pending JPS6360312U (en) | 1986-10-02 | 1986-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6360312U (en) |
-
1986
- 1986-10-02 JP JP15225186U patent/JPS6360312U/ja active Pending
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