JPH0170350U - - Google Patents
Info
- Publication number
- JPH0170350U JPH0170350U JP1987163629U JP16362987U JPH0170350U JP H0170350 U JPH0170350 U JP H0170350U JP 1987163629 U JP1987163629 U JP 1987163629U JP 16362987 U JP16362987 U JP 16362987U JP H0170350 U JPH0170350 U JP H0170350U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- semiconductor element
- injection hole
- resin injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の構造図、第２図は
本考案の一実施例の樹脂封止の説明図、第３図は
本考案の量産時の説明図、第４図は従来の樹脂封
止半導体装置の外観図、第５図は従来の樹脂封止
の説明図である。
１……基板、２……半導体素子、３……金線、
４……電極端子部、５……樹脂注入用の穴、６…
…封止樹脂。
Fig. 1 is a structural diagram of an embodiment of the present invention, Fig. 2 is an explanatory diagram of resin sealing of an embodiment of the present invention, Fig. 3 is an explanatory diagram of the mass production of the present invention, and Fig. 4 is a conventional diagram. FIG. 5 is an explanatory diagram of conventional resin sealing. 1...Substrate, 2...Semiconductor element, 3...Gold wire,
4... Electrode terminal portion, 5... Hole for resin injection, 6...
...Sealing resin.
Claims (1)
れた樹脂注入用の穴と、該樹脂注入用の穴から注
入され前記半導体素子を被覆する封止樹脂とから
なる樹脂封止半導体装置。 A resin-sealed semiconductor device comprising a substrate on which a semiconductor element is mounted, a resin injection hole provided in the substrate, and a sealing resin injected through the resin injection hole to cover the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163629U JPH0170350U (en) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163629U JPH0170350U (en) | 1987-10-28 | 1987-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170350U true JPH0170350U (en) | 1989-05-10 |
Family
ID=31448520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163629U Pending JPH0170350U (en) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170350U (en) |
-
1987
- 1987-10-28 JP JP1987163629U patent/JPH0170350U/ja active Pending