JPH0330430U - - Google Patents
Info
- Publication number
- JPH0330430U JPH0330430U JP8995389U JP8995389U JPH0330430U JP H0330430 U JPH0330430 U JP H0330430U JP 8995389 U JP8995389 U JP 8995389U JP 8995389 U JP8995389 U JP 8995389U JP H0330430 U JPH0330430 U JP H0330430U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin sealing
- lead frame
- sealing device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例１を示す断面図、第２
図ａは本考案に係る樹脂封止絶縁型半導体装置を
示す平面図、第２図ｂは同側面図、第３図は本考
案の実施例２を示す断面図、第４図ａは本考案に
係る樹脂封止絶縁型半導体装置を示す平面図、第
４図ｂは同側面図、第５図は従来例を示す断面図
、第６図ａは従来の樹脂封止絶縁型半導体装置を
示す平面図、第６図ｂは同側面図である。
１……リードフレーム、２……アウターリード
部、３……半導体チツプ、４……樹脂流入ゲート
部、５……ヒートシンク取付面、６……樹脂、７
……半導体装置取付ネジ挿入孔部。
Fig. 1 is a sectional view showing the first embodiment of the present invention;
Figure a is a plan view showing a resin-sealed insulated semiconductor device according to the present invention, Figure 2 b is a side view of the same, Figure 3 is a sectional view showing Embodiment 2 of the present invention, and Figure 4 a is a diagram showing the present invention. FIG. 4b is a side view of the same, FIG. 5 is a cross-sectional view of a conventional example, and FIG. 6a is a conventional resin-sealed insulated semiconductor device. The plan view and FIG. 6b are the same side views. DESCRIPTION OF SYMBOLS 1... Lead frame, 2... Outer lead part, 3... Semiconductor chip, 4... Resin inflow gate part, 5... Heat sink mounting surface, 6... Resin, 7
...Semiconductor device mounting screw insertion hole.
Claims (1)
で封止する樹脂封止装置において、樹脂封止用金
型に、リードフレームを境にして上側とヒートシ
ンク取付面となる下側２ケ所に樹脂流入ゲート部
を設けたことを特徴とする樹脂封止装置。 In a resin sealing device that seals a semiconductor chip mounted on a lead frame with resin, the resin sealing mold has resin inflow gates in two places, one on the upper side of the lead frame and the other on the lower side which is the heat sink mounting surface. A resin sealing device characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8995389U JPH0330430U (en) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8995389U JPH0330430U (en) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330430U true JPH0330430U (en) | 1991-03-26 |
Family
ID=31639502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8995389U Pending JPH0330430U (en) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330430U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577333U (en) * | 1992-03-24 | 1993-10-22 | 有限会社聖建設 | Formwork and rebar retainer and formwork connection connector for outer insulation foundation work |
| JPH072540U (en) * | 1992-03-05 | 1995-01-13 | 靖郎 中西 | A foldable wire mesh formwork for concrete pouring. |
-
1989
- 1989-07-31 JP JP8995389U patent/JPH0330430U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072540U (en) * | 1992-03-05 | 1995-01-13 | 靖郎 中西 | A foldable wire mesh formwork for concrete pouring. |
| JPH0577333U (en) * | 1992-03-24 | 1993-10-22 | 有限会社聖建設 | Formwork and rebar retainer and formwork connection connector for outer insulation foundation work |
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