JPH03101542U - - Google Patents
Info
- Publication number
- JPH03101542U JPH03101542U JP1990009191U JP919190U JPH03101542U JP H03101542 U JPH03101542 U JP H03101542U JP 1990009191 U JP1990009191 U JP 1990009191U JP 919190 U JP919190 U JP 919190U JP H03101542 U JPH03101542 U JP H03101542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- encapsulated
- resin material
- thermal conductivity
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図はこの考案の一実施例による半導体装置
の断面図、第２図は従来の半導体装置の断面図で
ある。
図において、１……半導体素子、２……封止樹
脂材、３……ダイパツド、４……ワイヤ、５……
リードフレーム、６……放熱板を示す。なお、図
中、同一符号は同一、または相当部分を示す。
FIG. 1 is a sectional view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional semiconductor device. In the figure, 1... semiconductor element, 2... sealing resin material, 3... die pad, 4... wire, 5...
Lead frame, 6... indicates a heat sink. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
、半導体装置の封止樹脂材の上下面に高熱伝導の
金属板を装着したことを特徴とする半導体装置。 What is claimed is: 1. A semiconductor device in which a semiconductor element is encapsulated in resin, characterized in that metal plates with high thermal conductivity are attached to the upper and lower surfaces of the encapsulating resin material of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009191U JPH03101542U (en) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009191U JPH03101542U (en) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101542U true JPH03101542U (en) | 1991-10-23 |
Family
ID=31512795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009191U Pending JPH03101542U (en) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101542U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031394A1 (en) * | 1996-02-22 | 1997-08-28 | Nitto Denko Corporation | Semiconductor device and method for manufacturing the same |
| JP2011023463A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Semiconductor module |
-
1990
- 1990-02-01 JP JP1990009191U patent/JPH03101542U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031394A1 (en) * | 1996-02-22 | 1997-08-28 | Nitto Denko Corporation | Semiconductor device and method for manufacturing the same |
| JP2011023463A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Semiconductor module |
| US9449893B2 (en) | 2009-07-14 | 2016-09-20 | Denso Corporation | Semiconductor module |