JPS62151751U - - Google Patents
Info
- Publication number
- JPS62151751U JPS62151751U JP3930886U JP3930886U JPS62151751U JP S62151751 U JPS62151751 U JP S62151751U JP 3930886 U JP3930886 U JP 3930886U JP 3930886 U JP3930886 U JP 3930886U JP S62151751 U JPS62151751 U JP S62151751U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin mold
- semiconductor
- resin
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例に係るモールド金型
の断面図、第２図は同半導体装置の側面図である
。
図中、６は半導体チツプ、８はリードフレーム
、１４は突き上げピン、１６はモールド部、１８
は底面、２０は段差部、２２はバリである。
FIG. 1 is a sectional view of a mold according to an embodiment of the present invention, and FIG. 2 is a side view of the same semiconductor device. In the figure, 6 is a semiconductor chip, 8 is a lead frame, 14 is a push-up pin, 16 is a mold part, and 18 is a
20 is a bottom surface, 20 is a stepped portion, and 22 is a burr.
Claims (1)
されるリードと該半導体チツプ及びリードの一部
を埋め込む樹脂モールド部とを有する半導体装置
において、 該樹脂モールド部の底面は放熱板に接触してと
りつけられるものであつて、該底面周辺部に、所
定の凹形状であつて樹脂硬化後の突き上げピンが
突き上げられる段差部を設けたことを特徴とする
樹脂モールドタイプの半導体装置。[Scope of Claim for Utility Model Registration] In a semiconductor device having a semiconductor chip, leads electrically connected to the semiconductor chip, and a resin mold part in which the semiconductor chip and part of the leads are embedded, the bottom surface of the resin mold part is A resin mold type semiconductor that is mounted in contact with a heat sink, and is characterized in that a stepped portion having a predetermined concave shape and into which a push-up pin is pushed up after the resin is cured is provided on the periphery of the bottom surface. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930886U JPS62151751U (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930886U JPS62151751U (en) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151751U true JPS62151751U (en) | 1987-09-26 |
Family
ID=30852344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3930886U Pending JPS62151751U (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151751U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0615339U (en) * | 1992-07-24 | 1994-02-25 | 日本特殊陶業株式会社 | Ladder type electric filter |
-
1986
- 1986-03-18 JP JP3930886U patent/JPS62151751U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0615339U (en) * | 1992-07-24 | 1994-02-25 | 日本特殊陶業株式会社 | Ladder type electric filter |
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