JPS61207036U - - Google Patents
Info
- Publication number
- JPS61207036U JPS61207036U JP9324985U JP9324985U JPS61207036U JP S61207036 U JPS61207036 U JP S61207036U JP 9324985 U JP9324985 U JP 9324985U JP 9324985 U JP9324985 U JP 9324985U JP S61207036 U JPS61207036 U JP S61207036U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- bonded
- heat
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はａ，ｂ本考案の一実施例を示すトラン
スフアモールド前の平面図及び断面図、第２図ａ
，ｂはトランスフアモールド後を示す平面図及び
断面図、第３図ａ，ｂは従来例を示すトランスフ
アモールド前の平面図及び断面図、第４図は完成
品の平面図及び断面図である。
１１…リードフレーム、１２…放熱フイン部、
１３…チツプ、１４…取付け穴、１６…ポリイミ
ドフイルム。
Figure 1 is a, b A plan view and cross-sectional view before transfer molding showing an embodiment of the present invention, Figure 2 a
, b are a plan view and a sectional view after transfer molding, FIGS. 3 a and b are a plan view and a sectional view before transfer molding, and FIG. 4 is a plan view and a sectional view of the finished product. be. 11...Lead frame, 12...Radiation fin part,
13... Chip, 14... Mounting hole, 16... Polyimide film.
Claims (1)
ツプをダイボンドするとともに、前記放熱フイン
部の取付け穴周辺に耐熱性・可撓性あるフイルム
を接着して樹脂モールドパツケージしてなること
を特徴とするＤＩＰ型パワーデバイス。 A DIP type characterized in that a chip is die-bonded to a heat dissipation fin formed on a lead frame, and a heat-resistant and flexible film is bonded around the mounting hole of the heat dissipation fin to form a resin molded package. power device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324985U JPS61207036U (en) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9324985U JPS61207036U (en) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207036U true JPS61207036U (en) | 1986-12-27 |
Family
ID=30650758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9324985U Pending JPS61207036U (en) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207036U (en) |
-
1985
- 1985-06-18 JP JP9324985U patent/JPS61207036U/ja active Pending