JPS6291445U - - Google Patents
Info
- Publication number
- JPS6291445U JPS6291445U JP18234785U JP18234785U JPS6291445U JP S6291445 U JPS6291445 U JP S6291445U JP 18234785 U JP18234785 U JP 18234785U JP 18234785 U JP18234785 U JP 18234785U JP S6291445 U JPS6291445 U JP S6291445U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heat dissipation
- dissipation section
- resin
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 3
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図は本考案の一実施例の断面図、
平面図、第３図、第４図は従来例の断面図、平面
図である。
１……半導体素子チツプ、２，２ａ……リード
フレーム、３……樹脂充てん部、４……封止成形
用金型、５ａ，５ｂ……放熱板固着用ピン、６…
…リードフレーム固着用ピン、７……放熱板固着
ピン支持部、８……放熱板と素子部リードフレー
ム接続樹脂層。
Figures 1 and 2 are cross-sectional views of an embodiment of the present invention;
The plan view, FIGS. 3 and 4 are a sectional view and a plan view of the conventional example. DESCRIPTION OF SYMBOLS 1...Semiconductor element chip, 2, 2a...Lead frame, 3...Resin filling part, 4...Mold for sealing molding, 5a, 5b...Pin for fixing heat sink, 6...
... Lead frame fixing pin, 7... Heat sink fixing pin support part, 8... Heat sink and element lead frame connection resin layer.
Claims (1)
、前記リードフレームと分離された放熱部と、内
部で前記リードフレームを前記放熱部に接続する
封止用樹脂とを具備し、前記放熱部から外部に放
熱するようにしたことを特徴とする樹脂封止形半
導体装置。 The device includes a lead frame on which a semiconductor element chip is mounted, a heat dissipation section separated from the lead frame, and a sealing resin that internally connects the lead frame to the heat dissipation section, and radiates heat from the heat dissipation section to the outside. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18234785U JPS6291445U (en) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18234785U JPS6291445U (en) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291445U true JPS6291445U (en) | 1987-06-11 |
Family
ID=31128059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18234785U Pending JPS6291445U (en) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291445U (en) |
-
1985
- 1985-11-26 JP JP18234785U patent/JPS6291445U/ja active Pending