JPS63131138U - - Google Patents
Info
- Publication number
- JPS63131138U JPS63131138U JP2300587U JP2300587U JPS63131138U JP S63131138 U JPS63131138 U JP S63131138U JP 2300587 U JP2300587 U JP 2300587U JP 2300587 U JP2300587 U JP 2300587U JP S63131138 U JPS63131138 U JP S63131138U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- exposed
- sealing
- semiconductor device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の樹脂封止型半導体装置の平面
図、第２図は第１図における―′線の断面図
、第３図は本考案におけるリードを金型に装着し
た際の概略図、第４図は従来の樹脂封止型半導体
装置の断面図である。
１は放熱金属部、２は凹部、３，４はリード、
５は金型である。
Fig. 1 is a plan view of the resin-sealed semiconductor device of the present invention, Fig. 2 is a sectional view taken along the line -' in Fig. 1, and Fig. 3 is a schematic diagram of the lead of the present invention when it is attached to a mold. , FIG. 4 is a sectional view of a conventional resin-sealed semiconductor device. 1 is a heat dissipation metal part, 2 is a recessed part, 3 and 4 are leads,
5 is a mold.
Claims (1)
いる樹脂封止型半導体装置に於いて、前記封止樹
脂外部に露出するリードの放熱金属部は露出部の
周辺に添つて凹部を有し、前記凹部で樹脂封止の
際の樹脂もれを止めることを特徴とした樹脂封止
型半導体装置。 In a resin-sealed semiconductor device in which a heat dissipating metal portion of a lead is exposed to the outside of the sealing resin, the heat dissipating metal portion of the lead exposed to the outside of the sealing resin has a recess along the periphery of the exposed portion. . A resin-sealed semiconductor device, wherein the recess prevents resin leakage during resin sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300587U JPS63131138U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300587U JPS63131138U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131138U true JPS63131138U (en) | 1988-08-26 |
Family
ID=30820926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300587U Pending JPS63131138U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131138U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853152B2 (en) * | 1980-12-17 | 1983-11-28 | 株式会社 長谷川工務店 | Joining method in prefabricated construction method |
-
1987
- 1987-02-19 JP JP2300587U patent/JPS63131138U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853152B2 (en) * | 1980-12-17 | 1983-11-28 | 株式会社 長谷川工務店 | Joining method in prefabricated construction method |