JPH01129839U - - Google Patents
Info
- Publication number
- JPH01129839U JPH01129839U JP1988024590U JP2459088U JPH01129839U JP H01129839 U JPH01129839 U JP H01129839U JP 1988024590 U JP1988024590 U JP 1988024590U JP 2459088 U JP2459088 U JP 2459088U JP H01129839 U JPH01129839 U JP H01129839U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- cap
- chip
- splash guard
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のパツケージを使用
しているパワートランジスタの断面図、第２図は
従来のパツケージを使用しているパワートランジ
スタの断面図である。
１，１１……キヤツプ、２，１２……ステム、
３，１３……リード、４，１４……半導体チツプ
（チツプに対応する。）、５，１５……ボンデイ
ングワイヤ、６……スプラツシユガード、７，１
７……溶接部、８，１８……キヤツプのフランジ
。
FIG. 1 is a sectional view of a power transistor using a package according to an embodiment of the present invention, and FIG. 2 is a sectional view of a power transistor using a conventional package. 1, 11... Cap, 2, 12... Stem,
3, 13... Lead, 4, 14... Semiconductor chip (corresponds to the chip), 5, 15... Bonding wire, 6... Splash guard, 7, 1
7... Welded part, 8, 18... Cap flange.
Claims (1)
気から遮断するキヤツプからなり、前記キヤツプ
のフランジが前記ステムの周縁部に溶接される電
子部品のパツケージにおいて、前記チツプを囲む
筒上のスプラツシユガードが前記ステム上に立設
してあり、前記ステム上に覆せた前記キヤツプの
内周壁に前記スプラツシユガードの開口端がすき
まなく接していることを特徴とする電子部品のパ
ツケージ。 In an electronic component package consisting of a stem to which a chip is fixed and a cap that isolates the chip from the outside air, and a flange of the cap is welded to the peripheral edge of the stem, a splash guard on a cylinder surrounding the chip is provided. A package for electronic parts, characterized in that the splash guard is erected on the stem, and the open end of the splash guard is in contact with the inner circumferential wall of the cap that can be covered over the stem without a gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988024590U JPH01129839U (en) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988024590U JPH01129839U (en) | 1988-02-25 | 1988-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129839U true JPH01129839U (en) | 1989-09-04 |
Family
ID=31244564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988024590U Pending JPH01129839U (en) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129839U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017512963A (en) * | 2014-04-18 | 2017-05-25 | 東莞市金瑞五金股▲ふん▼有限公司 | Liquid accumulator for compressor |
-
1988
- 1988-02-25 JP JP1988024590U patent/JPH01129839U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017512963A (en) * | 2014-04-18 | 2017-05-25 | 東莞市金瑞五金股▲ふん▼有限公司 | Liquid accumulator for compressor |