JPS6324842U - - Google Patents
Info
- Publication number
- JPS6324842U JPS6324842U JP1986117701U JP11770186U JPS6324842U JP S6324842 U JPS6324842 U JP S6324842U JP 1986117701 U JP1986117701 U JP 1986117701U JP 11770186 U JP11770186 U JP 11770186U JP S6324842 U JPS6324842 U JP S6324842U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fixed
- semiconductor device
- dissipation plate
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 4
- 230000005855 radiation Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図ａ，ｂは本考案の一実施例の半導体装置
を示す断面図および上面図、第２図ａ，ｂは従来
の半導体装置の断面図および上面図、第２図ｃは
放熱フインを示す断面図である。
１……リードピン、２……ロー材、３……ボン
デイングワイヤー、４……チツプ、５……ケース
本体、６……接合部、７……放熱板、８……放熱
フイン用凹み、９……キヤツプ、１０……放熱フ
イン、１１……放熱フイン接合部。
Figures 1a and b are a cross-sectional view and a top view of a semiconductor device according to an embodiment of the present invention, Figures 2a and b are a cross-sectional view and a top view of a conventional semiconductor device, and Figure 2c is a sectional view of a conventional semiconductor device. FIG. DESCRIPTION OF SYMBOLS 1... Lead pin, 2... Brazing material, 3... Bonding wire, 4... Chip, 5... Case body, 6... Joint part, 7... Heat sink, 8... Recess for heat sink, 9... ... Cap, 10 ... Heat radiation fin, 11 ... Heat radiation fin joint.
Claims (1)
が固着されてなる半導体装置において、前記放熱
板のうち前記放熱フインが固定される部分が凹ん
でいることを特徴とする半導体装置。 1. A semiconductor device comprising a semiconductor chip fixed to a heat dissipation plate to which a heat dissipation fin is fixed, characterized in that a portion of the heat dissipation plate to which the heat dissipation fin is fixed is recessed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986117701U JPS6324842U (en) | 1986-07-30 | 1986-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986117701U JPS6324842U (en) | 1986-07-30 | 1986-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324842U true JPS6324842U (en) | 1988-02-18 |
Family
ID=31003458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986117701U Pending JPS6324842U (en) | 1986-07-30 | 1986-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324842U (en) |
-
1986
- 1986-07-30 JP JP1986117701U patent/JPS6324842U/ja active Pending