JPH0176057U - - Google Patents
Info
- Publication number
- JPH0176057U JPH0176057U JP1987171834U JP17183487U JPH0176057U JP H0176057 U JPH0176057 U JP H0176057U JP 1987171834 U JP1987171834 U JP 1987171834U JP 17183487 U JP17183487 U JP 17183487U JP H0176057 U JPH0176057 U JP H0176057U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- case
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の半導体集積回路のケースの実
施例の断面図である。第２図は従来の半導体集積
回路のケースの断面図である。
第１，２図において、１……冷却器、２……ヒ
ートシンク、３……ボンデイングワイヤ、４……
セラミツクケース、５……ピン、６……金属キヤ
ツプ、７……集積回路チツプ、８……集積回路チ
ツプ支持基板。
FIG. 1 is a sectional view of an embodiment of a case for a semiconductor integrated circuit according to the present invention. FIG. 2 is a sectional view of a case of a conventional semiconductor integrated circuit. In Figures 1 and 2, 1... cooler, 2... heat sink, 3... bonding wire, 4...
Ceramic case, 5... pin, 6... metal cap, 7... integrated circuit chip, 8... integrated circuit chip support substrate.
Claims (1)
事を特徴とする集積回路。 An integrated circuit characterized by a cooler connected to the top or bottom of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171834U JPH0176057U (en) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171834U JPH0176057U (en) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176057U true JPH0176057U (en) | 1989-05-23 |
Family
ID=31463839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171834U Pending JPH0176057U (en) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176057U (en) |
-
1987
- 1987-11-09 JP JP1987171834U patent/JPH0176057U/ja active Pending
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