JPH0426547U - - Google Patents
Info
- Publication number
- JPH0426547U JPH0426547U JP6811690U JP6811690U JPH0426547U JP H0426547 U JPH0426547 U JP H0426547U JP 6811690 U JP6811690 U JP 6811690U JP 6811690 U JP6811690 U JP 6811690U JP H0426547 U JPH0426547 U JP H0426547U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- semiconductor device
- fixing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図はこの実施例の一実施例の放熱板に凹部
構造を採用した樹脂封止型半導体装置の断面図で
ある。第２図は従来の樹脂封止型半導体装置の断
面図である。
１……放熱板、１ａ……リード、１ｂ……凹部
、２……ハンダ、３……半導体素子、３ａ……表
面電極部、４……金属導線、５……樹脂。
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device in which a concave structure is adopted for the heat sink of this embodiment. FIG. 2 is a sectional view of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1... Heat sink, 1a... Lead, 1b... Recessed part, 2... Solder, 3... Semiconductor element, 3a... Surface electrode part, 4... Metal conductor wire, 5... Resin.
Claims (1)
の凹部を有することを特徴とする樹脂封止型半導
体装置。 A resin-sealed semiconductor device characterized in that a heat sink for fixing a semiconductor element has a concave portion having the same shape as the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811690U JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811690U JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426547U true JPH0426547U (en) | 1992-03-03 |
Family
ID=31602279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6811690U Pending JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426547U (en) |
-
1990
- 1990-06-27 JP JP6811690U patent/JPH0426547U/ja active Pending