JPH0170347U - - Google Patents
Info
- Publication number
- JPH0170347U JPH0170347U JP1987164705U JP16470587U JPH0170347U JP H0170347 U JPH0170347 U JP H0170347U JP 1987164705 U JP1987164705 U JP 1987164705U JP 16470587 U JP16470587 U JP 16470587U JP H0170347 U JPH0170347 U JP H0170347U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- lead frame
- metal body
- semiconductor pellet
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは、それぞれ本考案の一実施例の
半導体装置の平面図及び縦断面図、第２図ａ，ｂ
はそれぞれ本考案の他の実施例の半導体装置の平
面図及び縦断面図、第３図ａ，ｂはそれぞれ従来
の半導体装置の平面図及び縦断面図である。
１……樹脂、２……取付穴、３……リードフレ
ーム、４……半田、５……ペレツト、６……放熱
板。
FIGS. 1a and 1b are a plan view and a vertical cross-sectional view of a semiconductor device according to an embodiment of the present invention, and FIGS. 2a and 2b are
3A and 3B are a plan view and a longitudinal sectional view, respectively, of a semiconductor device according to another embodiment of the present invention, and FIGS. 3A and 3B are a plan view and a longitudinal sectional view, respectively, of a conventional semiconductor device. 1... Resin, 2... Mounting hole, 3... Lead frame, 4... Solder, 5... Pellet, 6... Heat sink.
Claims (1)
面に搭載するリードフレームと、前記半導体ペレ
ツトと接続されるリードと、前記リードフレーム
の前記―主面に固着された金属体と、前記半導体
ペレツト、前記リードフレームの前記―主面及び
前記金属体の側面を覆い、前記リードフレームの
前記―主面とは反対側の他の主面及び前記金属体
の前記リードフレームに固着された一主面とは反
対側の他の主面を露出して設けられた樹脂と、前
記金属体及び前記リードフレームを貫通し前記金
属体の前記他の主面より前記リードフレームの前
記他の主面に致る取付穴とを有することを特徴と
する半導体装置。 A semiconductor pellet, a lead frame on which the semiconductor pellet is mounted on one main surface, a lead connected to the semiconductor pellet, a metal body fixed to the main surface of the lead frame, the semiconductor pellet, and the lead. Covers the main surface of the frame and the side surface of the metal body, and covers the other main surface of the lead frame opposite to the main surface and the one main surface of the metal body opposite to the main surface fixed to the lead frame. a resin provided with the other main surface exposed on the side; and a mounting hole that penetrates the metal body and the lead frame and extends from the other main surface of the metal body to the other main surface of the lead frame. A semiconductor device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164705U JPH0170347U (en) | 1987-10-27 | 1987-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987164705U JPH0170347U (en) | 1987-10-27 | 1987-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170347U true JPH0170347U (en) | 1989-05-10 |
Family
ID=31450549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987164705U Pending JPH0170347U (en) | 1987-10-27 | 1987-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170347U (en) |
-
1987
- 1987-10-27 JP JP1987164705U patent/JPH0170347U/ja active Pending