JPH0262743U - - Google Patents
Info
- Publication number
- JPH0262743U JPH0262743U JP14125988U JP14125988U JPH0262743U JP H0262743 U JPH0262743 U JP H0262743U JP 14125988 U JP14125988 U JP 14125988U JP 14125988 U JP14125988 U JP 14125988U JP H0262743 U JPH0262743 U JP H0262743U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- semiconductor image
- package
- mounting part
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案の半導体撮像素子収納用パツケ
ージの一実施例を示す平面図、第２図は第１図に
示すパツケージの断面図、第３図は従来の半導体
撮像素子収納用パツケージの平面図、第４図は第
３図に示すパツケージの断面図である。
１…金属基体、１ａ：半導体撮像素子載置部、
１ｂ：突起、２：絶縁枠体。
FIG. 1 is a plan view showing an embodiment of a package for housing a semiconductor image sensor according to the present invention, FIG. 2 is a sectional view of the package shown in FIG. 1, and FIG. 3 is a plan view of a conventional package for housing a semiconductor image sensor. 4 are cross-sectional views of the package shown in FIG. 3. 1... Metal base, 1a: Semiconductor image sensor mounting part,
1b: protrusion, 2: insulating frame.
Claims (1)
有する金属基体上に、前記載置部を囲繞するよう
にして絶縁枠体をロウ付けして成る半導体撮像素
子収納用パツケージにおいて、前記絶縁基体の半
導体撮像素子載置部に該半導体撮像素子の取着位
置を規定するための突起を設けたことを特徴とす
る半導体撮像素子収納用パツケージ。 A package for housing a semiconductor image sensor, which is formed by brazing an insulating frame body to a metal base having a mounting part in the center on which the semiconductor image sensor is mounted, so as to surround the mounting part. 1. A package for storing a semiconductor image sensor, characterized in that a protrusion for defining a mounting position of the semiconductor image sensor is provided on the semiconductor image sensor mounting portion of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125988U JPH0262743U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125988U JPH0262743U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262743U true JPH0262743U (en) | 1990-05-10 |
Family
ID=31406176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14125988U Pending JPH0262743U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262743U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |
| CN106463515A (en) * | 2014-06-25 | 2017-02-22 | 京瓷株式会社 | Image pickup element mounting substrate and image pickup device |
-
1988
- 1988-10-28 JP JP14125988U patent/JPH0262743U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448861B2 (en) | 2003-06-26 | 2008-11-11 | Nec Electronics Corporation | Resin molded semiconductor device and mold |
| CN106463515A (en) * | 2014-06-25 | 2017-02-22 | 京瓷株式会社 | Image pickup element mounting substrate and image pickup device |
| JPWO2015199134A1 (en) * | 2014-06-25 | 2017-06-08 | 京セラ株式会社 | Imaging device mounting substrate and imaging apparatus |
| US10319759B2 (en) | 2014-06-25 | 2019-06-11 | Kyocera Corporation | Image pickup element mounting substrate and image pickup device |
| CN106463515B (en) * | 2014-06-25 | 2020-01-14 | 京瓷株式会社 | Substrate for mounting imaging element and imaging device |