JPH0247049U - - Google Patents
Info
- Publication number
- JPH0247049U JPH0247049U JP1988126836U JP12683688U JPH0247049U JP H0247049 U JPH0247049 U JP H0247049U JP 1988126836 U JP1988126836 U JP 1988126836U JP 12683688 U JP12683688 U JP 12683688U JP H0247049 U JPH0247049 U JP H0247049U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- insulating frame
- placing part
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。
１……金属基体、１ａ……半導体素子載置部、
１ｂ……金属層、２……絶縁枠体、Ａ……切欠部
。
FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. 1...Metal base, 1a...Semiconductor element mounting part,
1b...Metal layer, 2...Insulating frame, A...Notch.
Claims (1)
る金属基体上に、前記載置部を囲繞するようにし
て絶縁枠体をロウ付けして成る半導体素子収納用
パツケージにおいて、前記絶縁枠体の下面内周角
部に切欠部を形成したことを特徴とする半導体素
子収納用パツケージ。 In a package for housing a semiconductor element, an insulating frame is brazed to a metal base having a placing part in the center on which the semiconductor element is placed, and the insulating frame surrounds the placing part. A package for storing semiconductor elements, characterized in that a cutout is formed at an inner peripheral corner of a lower surface of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247049U true JPH0247049U (en) | 1990-03-30 |
Family
ID=31378719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126836U Pending JPH0247049U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247049U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (en) * | 1982-07-20 | 1984-01-28 | Nec Corp | Ceramic package semiconductor device |
| JPS60214546A (en) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | Semiconductor device |
| JPS613663A (en) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | Pretreatment for brazing of metallic members |
| JPS6252949A (en) * | 1985-08-30 | 1987-03-07 | Nec Corp | Laminated type ceramic package |
-
1988
- 1988-09-27 JP JP1988126836U patent/JPH0247049U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (en) * | 1982-07-20 | 1984-01-28 | Nec Corp | Ceramic package semiconductor device |
| JPS60214546A (en) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | Semiconductor device |
| JPS613663A (en) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | Pretreatment for brazing of metallic members |
| JPS6252949A (en) * | 1985-08-30 | 1987-03-07 | Nec Corp | Laminated type ceramic package |