JPH0179830U - - Google Patents

Info

Publication number
JPH0179830U
JPH0179830U JP17613687U JP17613687U JPH0179830U JP H0179830 U JPH0179830 U JP H0179830U JP 17613687 U JP17613687 U JP 17613687U JP 17613687 U JP17613687 U JP 17613687U JP H0179830 U JPH0179830 U JP H0179830U
Authority
JP
Japan
Prior art keywords
semiconductor elements
insulating base
package
storage
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17613687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17613687U priority Critical patent/JPH0179830U/ja
Publication of JPH0179830U publication Critical patent/JPH0179830U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……絶縁基体、１ａ……凸部、２……蓋体、
４……半導体素子、５……金属層。 FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. 1... Insulating base, 1a... Convex portion, 2... Lid,
4...Semiconductor element, 5...Metal layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の半導体素子を取着収容するための凹部を
有する絶縁基体と蓋体とから成る半導体素子収納
用パツケージにおいて、前記絶縁基体の凹部底面
に、夫々の半導体素子が取着される領域を区分す
るための高さ０．４mm以下の凸部を設けたことを
特徴とする半導体素子収納用パツケージ。 In a semiconductor element storage package comprising an insulating base and a lid having recesses for mounting and accommodating a plurality of semiconductor elements, regions where respective semiconductor elements are attached are divided on the bottom surface of the recess of the insulating base. A package for storing semiconductor elements, characterized in that a convex portion with a height of 0.4 mm or less is provided for storage.
JP17613687U 1987-11-18 1987-11-18 Pending JPH0179830U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17613687U JPH0179830U (en) 1987-11-18 1987-11-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17613687U JPH0179830U (en) 1987-11-18 1987-11-18

Publications (1)

Publication Number Publication Date
JPH0179830U true JPH0179830U (en) 1989-05-29

Family

ID=31467893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17613687U Pending JPH0179830U (en) 1987-11-18 1987-11-18

Country Status (1)

Country Link
JP (1) JPH0179830U (en)

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